Patents by Inventor Man-Heung Lee

Man-Heung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6762615
    Abstract: A parallel test board preferably includes a plurality of serial slots connected to a motherboard and a number of parallel slots connected to the motherboard in parallel with each other. The motherboard provides an actual operational environment for devices under test (DUTs). DUTs are mounted in the slots. Using a plurality of serial slots, distorted timings due to one serial slot (e.g., an extension slot) have an influence on the other serial slot (e.g., a reference slot), as well as on the parallel slots. In this manner, a timing margin failure occurring during a multi-bank operation can be effectively detected. The slots to which the DUTs are mounted preferably have a socket structure with a support block having contact pins arranged thereon. Each of the contact pins preferably has a module contact part configured to contact a tab of the DUT and a board contact part configured to contact conductive wiring patterns of an intermediation board.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: July 13, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Man-Heung Lee, Chang-Ho Lee, Sang-Chul Yun, Si-Don Choi
  • Publication number: 20020125879
    Abstract: A parallel test board preferably includes a plurality of serial slots connected to a motherboard and a number of parallel slots connected to the motherboard in parallel with each other. The motherboard provides an actual operational environment for devices under test (DUTs). DUTs are mounted in the slots. Using a plurality of serial slots, distorted timings due to one serial slot (e.g., an extension slot) have an influence on the other serial slot (e.g., a reference slot), as well as on the parallel slots. In this manner, a timing margin failure occurring during a multi-bank operation can be effectively detected. The slots to which the DUTs are mounted preferably have a socket structure with a support block having contact pins arranged thereon. Each of the contact pins preferably has a module contact part configured to contact a tab of the DUT and a board contact part configured to contact conductive wiring patterns of an intermediation board.
    Type: Application
    Filed: March 8, 2002
    Publication date: September 12, 2002
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Man-Heung Lee, Chang-Ho Lee, Sang-Chul Yun, Si-Don Choi