Patents by Inventor Man Ho Hui

Man Ho Hui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold for encapsulating a semiconductor chip
    Patent number: 6860731
    Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: March 1, 2005
    Assignee: ASM Technology Singapore PTE Ltd.
    Inventors: Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Srikanth Narasimulau, Murali Sarangapani
  • Mold and method for encapsulation of electronic device
    Patent number: 6770163
    Abstract: A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: August 3, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: Teng Hock Kuah, Shu Chuen Ho, Charles Joseph Vath, III, Loon Aik Lim, Man Ho Hui, Juay Sim Koh
  • Molding apparatus
    Patent number: 6709252
    Abstract: Molding apparatus (200) is provided for simultaneously molding a molding material around a number of separate substrates, each substrate having a semiconductor chip mounted thereon. The apparatus includes a mold holder (113a, 113b, 114, 103) having a first holding section for holding a first mold half (119) and a second holding section for holding a second mold half (120). The first and second holding sections have a common support surface (135), the support surface (135) including a first movable member (104a) in the first holding section and a second movable member (104b) in the second holding section. The first and second movable members (104a, 104b) are movable between a first position in which they protrude out of the support surface (135) and a second position in which the protrusion from the support surface (135) is less than in the first position.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: March 23, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: Jie Liu, Si Liang Lu, Shu Chuen Ho, Man Ho Hui, Teng Hock Kuah
  • Molding apparatus
    Publication number: 20030012836
    Abstract: Molding apparatus (200) is provided for simultaneously molding a molding material around a number of separate substrates, each substrate having a semiconductor chip mounted thereon. The apparatus includes a mold holder (113a, 113b, 114, 103) having a first holding section for holding a first mold half (119) and a second holding section for holding a second mold half (120). The first and second holding sections have a common support surface (135), the support surface (135) including a first movable member (104a) in the first holding section and a second movable member (104b) in the second holding section. The first and second movable members (104a, 104b) are movable between a first position in which they protrude out of the support surface (135) and a second position in which the protrusion from the support surface (135) is less than in the first position.
    Type: Application
    Filed: July 10, 2001
    Publication date: January 16, 2003
    Inventors: Jie Liu, Si Liang Lu, Shu Chuen Ho, Man Ho Hui, Teng Hock Kuah
  • Mold
    Publication number: 20030006529
    Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.
    Type: Application
    Filed: July 9, 2001
    Publication date: January 9, 2003
    Applicant: ASM Technology Singapore Pte Ltd
    Inventors: Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Srikanth Narasimalu, Murali Sarangapani