Patents by Inventor Man Hue Choi
Man Hue Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240040929Abstract: A thermoelectric device according to an embodiment of the present invention comprises: a first substrate; an insulating layer disposed on the first substrate; a first electrode unit disposed on the insulating layer; a first terminal electrode and a second terminal electrode disposed on the insulating layer and protruding from the first electrode unit toward the first outer side of the first substrate; a semiconductor structure disposed on the first electrode unit; a second electrode unit disposed on the semiconductor structure; and a second substrate unit disposed on the second electrode unit. The second substrate unit comprises a plurality of second substrates disposed away from one another. The first electrode unit comprises: a plurality of electrode groups respectively overlapping the plurality of second substrates vertically; and a first connection electrode connecting two different electrode groups among the plurality of electrode groups.Type: ApplicationFiled: July 20, 2021Publication date: February 1, 2024Inventors: Man Hue CHOI, Jong Min LEE, Se Woon LEE, Yong Sang CHO
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Publication number: 20230309406Abstract: According to an embodiment, the present invention comprises: a first electrode; a first conductive bonding member disposed on the first electrode; and a plurality of semiconductor structures disposed on the first conductive bonding member, wherein the first conductive bonding member comprises first arrangement portions on which the plurality of semiconductor structures are arranged, respectively, and a first barrier portion positioned between the first arrangement portions, wherein the thickness of the first barrier portion is 2.5 times or less than the thickness of the first arrangement portion.Type: ApplicationFiled: July 15, 2021Publication date: September 28, 2023Applicant: LG INNOTEK CO., LTD.Inventors: Jong Min LEE, Se Woon LEE, Man Hue CHOI
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Publication number: 20230044428Abstract: A thermoelectric device according to one embodiment of the present invention includes a substrate, a first insulating layer disposed on the substrate, a second insulating layer disposed on the first insulating layer and having an area smaller than an area of the first insulating layer, a plurality of first electrodes disposed on the second insulating layer, a plurality of semiconductor structures disposed on the plurality of first electrodes, and a plurality of second electrodes disposed on the plurality of semiconductor structures, wherein the second insulating layer includes an overlapping region in which the plurality of first electrodes, the plurality of second electrodes, and the plurality of semiconductor structures overlap vertically and a protruding pattern protruding from the overlapping region toward a first outer side the substrate.Type: ApplicationFiled: October 25, 2021Publication date: February 9, 2023Inventors: Jong Min LEE, Yong Sang CHO, Man Hue CHOI
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Publication number: 20220320406Abstract: A thermoelectric device according to one embodiment of the present invention includes a first insulating layer, a first substrate disposed on the first insulating layer, a second insulating layer disposed on the first substrate, a first electrode disposed on the second insulating layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a third insulating layer disposed on the second electrode, and a second substrate disposed on the third insulating layer, wherein the first insulating layer includes a first aluminum oxide layer, the first substrate is an aluminum substrate, the second substrate is a copper substrate, the first substrate is a low temperature portion, and the second substrate is a high temperature portion.Type: ApplicationFiled: May 28, 2020Publication date: October 6, 2022Inventors: Man Hue CHOI, Yong Sang CHO
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Publication number: 20210143308Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other,Type: ApplicationFiled: November 4, 2020Publication date: May 13, 2021Inventors: Man Hue CHOI, Sue Kyung OH, Jong Min LEE
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Patent number: 10955282Abstract: A pressure detecting sensor according to an embodiment of the present invention comprises: a first electrode layer including a plurality of signal electrodes arranged in a first region and a plurality of wiring electrodes arranged in a second region and connected to the plurality of signal electrodes, the first electrode layer being made of a conductive fiber; an elastic dielectric layer arranged in the first region; and a second electrode layer arranged in the elastic dielectric layer, the second electrode layer being made of a conductive fiber.Type: GrantFiled: April 20, 2017Date of Patent: March 23, 2021Assignee: LG INNOTEK CO., LTD.Inventors: Man Hue Choi, Bi Yi Kim, Ji Hye Kim, Yong Hwa Park, Hyun Gyu Park, Hyung Yoon
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Patent number: 10876907Abstract: A pressure detection sensor according to one embodiment of the present invention includes a first electrode layer including a channel portion configured to output a sensing signal and a wiring portion connected to the channel portion, a first elastic dielectric layer disposed on the first electrode layer, a second electrode layer disposed on the first elastic dielectric layer at a position corresponding to the channel portion, a second elastic dielectric layer disposed on the second electrode layer, and a third electrode layer disposed on the second elastic dielectric layer, wherein, when a pressure is applied to the third electrode layer, capacitances of the first elastic dielectric layer and the second elastic dielectric layer are changed.Type: GrantFiled: May 23, 2017Date of Patent: December 29, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Hyung Yoon, Bi Yi Kim, Ji Hye Kim, Hyun Gyu Park, In Hee Cho, Man Hue Choi
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Publication number: 20190234814Abstract: A pressure detection sensor according to one embodiment of the present invention includes a first electrode layer including a channel portion configured to output a sensing signal and a wiring portion connected to the channel portion, a first elastic dielectric layer disposed on the first electrode layer, a second electrode layer disposed on the first elastic dielectric layer at a position corresponding to the channel portion, a second elastic dielectric layer disposed on the second electrode layer, and a third electrode layer disposed on the second elastic dielectric layer, wherein, when a pressure is applied to the third electrode layer, capacitances of the first elastic dielectric layer and the second elastic dielectric layer are changed.Type: ApplicationFiled: May 23, 2017Publication date: August 1, 2019Inventors: Hyung YOON, Bi Yi KIM, Ji Hye KIM, Hyun Gyu PARK, In Hee CHO, Man Hue CHOI
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Patent number: 10291079Abstract: Provided is a wireless charging board including: a coil pattern; a soft magnetic layer having one side on which the coil pattern is disposed; and a heat dissipation layer disposed on the other side of the soft magnetic layer and including a first uneven pattern portion.Type: GrantFiled: January 28, 2015Date of Patent: May 14, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Man Hue Choi, Hyun Gyu Park, Seok Bae, Sang Won Lee
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Publication number: 20190137322Abstract: A pressure detecting sensor according to an embodiment of the present invention comprises: a first electrode layer including a plurality of signal electrodes arranged in a first region and a plurality of wiring electrodes arranged in a second region and connected to the plurality of signal electrodes, the first electrode layer being made of a conductive fiber; an elastic dielectric layer arranged in the first region; and a second electrode layer arranged in the elastic dielectric layer, the second electrode layer being made of a conductive fiber.Type: ApplicationFiled: April 20, 2017Publication date: May 9, 2019Applicant: LG Innotek Co., Ltd.Inventors: Man Hue CHOI, Bi Yi KIM, Ji Hye KIM, Yong Hwa PARK, Hyun Gyu PARK, Hyung YOON
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Patent number: 10191206Abstract: A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.Type: GrantFiled: June 11, 2014Date of Patent: January 29, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Man Hue Choi, Min Jae Kim, Bi Yi Kim, Se Woong Na, Hyun Gyu Park, In Hee Cho, Seung Kwon Hong
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Patent number: 10018777Abstract: A circuit board, and a lighting device and board housing module having the circuit board. The circuit board includes a support substrate having a first region and a second region bent from the first region, light emitting devices disposed on the first region, and a protective support portion protruding more than the light emitting devices from the support substrate of the first region.Type: GrantFiled: May 8, 2014Date of Patent: July 10, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Se Woong Na, Min Jae Kim, Bi Yi Kim, Hyun Gyu Park, In Hee Cho, Man Hue Choi, Seung Kwon Hong
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Patent number: 9851486Abstract: Provided is a lighting unit, including: a support substrate; a light guide plate for guiding light generated from a light source; and a first stopper fixed to the support substrate and configured to support the light guide plate.Type: GrantFiled: May 30, 2014Date of Patent: December 26, 2017Assignee: LG INNOTEK CO., LTDInventors: Man Hue Choi, Min Jae Kim, Bi Yi Kim, Se Woong Na, Hyun Gyu Park, In Hee Cho, Seung Kwon Hong
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Patent number: 9807880Abstract: Provided is a circuit board including: a supporting substrate including a first region to which light emitting elements are mounted and a second region extending to be bent from the first region, wherein the second region comprises: a connector mounting portion to which a connector for supplying an electric current to the light emitting elements is mounted; and a non-mounting portion of a connector separated and spaced apart from the connector mounting portion, wherein the connector mounting portion is formed lower than the non-mounting portion of the connector.Type: GrantFiled: June 25, 2014Date of Patent: October 31, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Hyun Gyu Park, Min Jae Kim, Se Woong Na, In Hee Cho, Man Hue Choi, Seung Kwon Hong
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Patent number: 9730319Abstract: Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.Type: GrantFiled: December 12, 2014Date of Patent: August 8, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Man Hue Choi, Min Jae Kim, Se Woong Na, Hyun Gyu Park, In Hee Cho, Seung Kwon Hong
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Patent number: 9726811Abstract: Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices.Type: GrantFiled: May 29, 2014Date of Patent: August 8, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Se Woong Na, Min Jae Kim, Bi Yi Kim, Hyun Gyu Park, In Hee Cho, Man Hue Choi, Seung Kwon Hong
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Patent number: 9726810Abstract: Provided are a lighting device and a flat panel display having the lighting device, the lighting device, including: a support substrate; a circuit board on the support substrate; light emitting devices mounted on the circuit board; and a light guide plate having a protruding portion protruding to a remaining region except for a region in which the light emitting devices are disposed.Type: GrantFiled: May 30, 2014Date of Patent: August 8, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Min Jae Kim, Bi Yi Kim, Se Woong Na, Hyun Gyu Park, In Hee Cho, Man Hue Choi, Seung Kwon Hong
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Publication number: 20170179753Abstract: Provided is a wireless charging board including: a coil pattern; a soft magnetic layer having one side on which the coil pattern is disposed; and a heat dissipation layer disposed on the other side of the soft magnetic layer and including a first uneven pattern portion.Type: ApplicationFiled: January 28, 2015Publication date: June 22, 2017Inventors: Man Hue Choi, Hyun Gyu Park, Seok Bae, Sang Won Lee
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Publication number: 20170003441Abstract: A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.Type: ApplicationFiled: June 11, 2014Publication date: January 5, 2017Inventors: Man Hue CHOI, Min Jae KIM, Bi Yi KIM, Se Woong NA, Hyun Gyu PARK, In Hee CHO, Seung Kwon HONG
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Patent number: 9506637Abstract: Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.Type: GrantFiled: August 28, 2014Date of Patent: November 29, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Hyun Gyu Park, Min Jae Kim, Se Woong Na, In Hee Cho, Man Hue Choi, Seung Kwon Hong