Patents by Inventor Man Jong KIM

Man Jong KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting composition and printed circuit board using the same
    Patent number: 8765012
    Abstract: A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: July 1, 2014
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd., Samsung Fine Chemicals Co., Ltd.
    Inventors: Myung Sup Jung, Chung Kun Cho, Kwang Hee Kim, Kalinina Fedosya, Man Jong Kim, Tae Jun Ok
  • THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20100124037
    Abstract: A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.
    Type: Application
    Filed: November 18, 2009
    Publication date: May 20, 2010
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG ELECTRO-MECHANICS CO., LTD., SAMSUNG FINE CHEMICALS CO., LTD.
    Inventors: Myung Sup JUNG, Chung Kun CHO, Kwang Hee KIM, Kalinina FEDOSYA, Man Jong KIM, Tae Jun OK