Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component including a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and first and second external electrodes respectively electrically connected to the first and second internal electrodes, disposed in an outer portion of the ceramic body. The first and second external electrodes include a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn). A ratio (t1/t2) between a thickness (t1) of the first plating layer including nickel (Ni) and a thickness (t2) of the second plating layer including tin (Sn) is within a range from 1.0 to 9.0.

Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body, and connected to the first and second connection electrodes; and third and fourth external electrodes connected to the third and fourth connection electrodes, and at least a portion of the first and second connection electrodes is exposed to the surface of the body.

Abstract: A multilayer ceramic capacitor includes a body including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween to be point-symmetrical to each other, first and second connection electrodes penetrating through the body in a direction perpendicular to the dielectric layer, and connected to the first internal electrode, third and fourth connection electrodes penetrating through the body in the direction perpendicular to the dielectric layer, and connected to the second internal electrode, first and second external electrodes disposed on both external surfaces of the body and connected to the first and second connection electrodes, and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes. Each of the first and second internal electrodes includes an electrode-unformed region.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

Abstract: An LED lighting apparatus including a rectifier to rectify AC voltages having different magnitudes and generate driving voltages corresponding to rectified voltages, a buck converter connected to an output terminal of the rectifier and generate an LED driving current corresponding to the driving voltages, a variable reference voltage comparator to receive the driving voltages, and generate variable reference voltages that fluctuate in correspondence to magnitudes of the output driving voltages, compare the driving voltages and the variable reference voltages, and output signals for controlling an operation of the buck converter, an LED including at least one LED group and driven by the LED driving current generated by the buck converter, and a controller including a converter controller to control the operation of the buck converter and a constant current controller to constant current-control the LED driving current applied to the at least one LED group.

Abstract: A capacitor component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other in a first direction of the body with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction of the body, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction of the body, and first and second external electrodes disposed in the body and connected to the first and second internal electrodes, respectively. The body has edges having a rounded shape.

Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes disposed to face each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode and a lead portion connected to the third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively; and a third external electrode disposed on the body to be connected to the lead portion.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

Abstract: A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1×Td and D2×Td are greater than 20 ?m2, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to face each other in a first direction while having the dielectric layer interposed therebetween, and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; first and second margin portions disposed on the fifth and sixth surfaces, respectively; first and second connection parts disposed on the third and fourth surfaces, respectively, and including metal layers connected to the first internal electrode and ceramic layers disposed on the metal layers; a connection electrode penetrating through the body and connected to the second internal electrode; a first external electrode disposed on one surface of the first connection part; a second external electrode disposed on one surface of the second connection part in the first direction; and a third external electrode disposed on the body and connected to the connection electrode.

Abstract: A capacitor component includes a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween to be exposed to the third and fourth surfaces of the body, respectively; first and second conductive layers covering the third and fourth surfaces and connected to the first and second internal electrodes, respectively; first and second insulating layers covering the first and second conductive layers, respectively; first and second band portions spaced apart from each other on the second surface of the body; first and second external electrodes covering a portion of the first and second band portions and the first insulating layer, respectively; and third and fourth external electrodes covering a portion of the first and second insulating layers and a portion of the first surface of the body, respectively; and a method of manufacturing the same.

Abstract: A capacitor component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other in a first direction of the body with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction of the body, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction of the body, and first and second external electrodes disposed in the body and connected to the first and second internal electrodes, respectively. The body has edges having a rounded shape.

Abstract: A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1×Td and D2×Td are greater than 20 ?m2, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component including a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and first and second external electrodes respectively electrically connected to the first and second internal electrodes, disposed in an outer portion of the ceramic body. The first and second external electrodes include a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn). A ratio (t1/t2) between a thickness (t1) of the first plating layer including nickel (Ni) and a thickness (t2) of the second plating layer including tin (Sn) is within a range from 1.0 to 9.0.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

Abstract: Multimodal polyolefin resins for manufacturing films, pipes, hollow molded articles having high melt strength and excellent formability, mechanical strength, processability and appearance are described. The resins have: density is 0.930-0.960 g/cm3; melt flow index is 0.01-10.0 g/10 minutes; ratio Mw/Mn is 10-60; and two or more peaks appear when molecular weight is measured by GPC. In molded pipe, the Mw of polymer collected at position B is 0.1% greater than Mw of polymer collected at position A; polymer having Mw of 10,000 or less among polymers collected at position A is 0.1% greater than the amount of polymer having Mw of 10,000 or less among polymers collected at position B; and the amount of polymer having Mw of 1,000,000 or more among polymers collected at position B is 0.1% greater than the amount of polymer having Mw of 1,000,000 or more among polymers collected at position A.