Abstract: An integrated circuit package and method of making the package which allows an integrated circuit die to be bonded to a substrate without need of a carrier. The integrated circuit die has opposed active and passive surfaces and has lateral surfaces. An electrically insulative layer of material is deposited on the passive and lateral surfaces. A metal mask is formed to cover the active surface and the coated lateral surfaces. The metal mask includes slots which extend up the lateral surfaces and onto the active surface. The array of slots corresponds to an array of input/output contact pads on the active side. Metal is sputtered into the slots, whereafter the mask is removed to provide L-shaped conductive traces from the contact pads along the active and lateral sides. The assembly can then be rested on a substrate on the passive surface and the L-shaped traces bonded to contact pads on the substrate. The assembly allows testing at the die level.

Abstract: A method of manufacturing a repairable multi-chip module including providing a plurality of tape automated bonded chips secured to a corresponding number of substrates by a first bonding material. A second bonding material having a melting point below that of the first bonding material is used to mechanically attach the substrates to a multi-chip package. However, the second bonding material is not melted until after all of the chips have been properly tested. Electrical attachment is provided prior to mechanical attachment by bonding leads of the tape automated bonding frame to the multi-chip module. Removing a defective chip requires only the detachment of the leads. A replacement chip and a replacement substrate are then inserted in the position previously maintained by the defective chip. After the entire module is tested positively, the second bonding material is melted to mechanically attach the substrates to the module. Hermetical sealing of the module is also by means of the second bonding material.

Abstract: An integrated circuit package and method of making the package which allows an integrated circuit die to be bonded to a substrate without need of a carrier. The integrated circuit die has opposed active and passive surfaces and has lateral surfaces. An electrically insulative layer of material is deposited on the passive and lateral surfaces. A metal mask is formed to cover the active surface and the coated lateral surfaces. The metal mask includes slots which extend up the lateral surfaces and onto the active surface. The array of slots corresponds to an array of input/output contact pads on the active side. Metal is sputtered into the slots, whereafter the mask is removed to provide L-shaped conductive traces from the contact pads along the active and lateral sides. The assembly can then be rested on a substrate on the passive surface and the L-shaped traces bonded to contact pads on the substrate. The assembly allows testing at the die level.

Abstract: A pressure sensing device comprising a body member and a cap member constructed with a simple snap-fit for assembly and disassembly. The assembled device permits non-bonded contact of conductive leads with electrically conductive elements of a pressure-responsive transducer die for sensing pressure and transmitting signals generated by the force of a pressurized medium in hollow a chamber of the body member. A seal provides for functional reliability independent of thermal cycling stresses.

Abstract: A wet-to-wet pressure sensor package (10) having a housing (12) with a pressure sensitive semiconductor die (34) supported within a resilient mounting (44) including continuous beads (46, 48) of elastomeric adhesive on the same portion of the housing to provide a protective seal with less stress so that improved sensitivity and repeatability of the wet-to-wet pressure sensor is achieved.

Abstract: A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components.A method of soldering a copper lead to a lead pad on a substrate. A conductor pattern including at least one lead pad is printed on the substrate using a gold thick film paste composition. The gold composition is composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, containing by weight 98-99 percent gold particles and complementally 2-1 percent of inorganic binder particles. The binder consists essentially by total weight of gold and binder of 0.6-0.2 percent copper, 0.2 percent lead, 0.2 percent cadmium and the balance being glass.