Patents by Inventor Man Kit Chow

Man Kit Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding tool and system
    Patent number: 10096568
    Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: October 9, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kwok Yuen Cheung, Kwok Wah Tong, Jin Hui Meng, Wan Yin Yau, Man Kit Chow
  • DIE BONDING TOOL AND SYSTEM
    Publication number: 20160086830
    Abstract: Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.
    Type: Application
    Filed: September 18, 2014
    Publication date: March 24, 2016
    Inventors: Kwok Yuen CHEUNG, Kwok Wah TONG, Jin Hui MENG, Wan Yin YAU, Man Kit CHOW
  • Vibration-induced die detachment system
    Patent number: 7757742
    Abstract: A die is detachable from an adhesive tape on which the die is mounted with a die detachment tool comprising a vacuum enclosure that is operative to provide a vacuum suction on the adhesive tape. One or more ejector pins are housed in the vacuum enclosure and are projectable from the vacuum enclosure for lifting the die and adhesive tape. A vibrational tool is housed in the vacuum enclosure adjacent to the ejector pins and it is projectable from the vacuum enclosure to contact a portion of the adhesive tape at which the die is located. The vibrational tool is further operative to oscillate the adhesive tape and die for promoting delamination of the die from the adhesive tape.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: July 20, 2010
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yiu Ming Cheung, Man Kit Chow
  • VIBRATION-INDUCED DIE DETACHMENT SYSTEM
    Publication number: 20090032186
    Abstract: A die is detachable from an adhesive tape on which the die is mounted with a die detachment tool comprising a vacuum enclosure that is operative to provide a vacuum suction on the adhesive tape. One or more ejector pins are housed in the vacuum enclosure and are projectable from the vacuum enclosure for lifting the die and adhesive tape. A vibrational tool is housed in the vacuum enclosure adjacent to the ejector pins and it is projectable from the vacuum enclosure to contact a portion of the adhesive tape at which the die is located. The vibrational tool is further operative to oscillate the adhesive tape and die for promoting delamination of the die from the adhesive tape.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 5, 2009
    Inventors: Yiu Ming Cheung, Man Kit Chow