Patents by Inventor Mankit Wong

Mankit Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal fill region of a semiconductor chip
    Patent number: 7489039
    Abstract: Disclosed is a metal fill region of a semiconductor chip including a plurality of layer sets of the semiconductor chip, each set including a first metal fill layer, a second metal fill layer, and an insulation layer included disposed in planes parallel to each other, a plurality of metal fill pieces disposed in each of the metal fill layers, a metal fill piece axis of each of the pieces, wherein each of the axes perpendicularly intersects the planes of said metal fill layers and the insulation layer from any point of reference, and a metal fill pattern configured to position the pieces so that the axis of each piece in the first metal fill layer is linearly displaced of the axis of each piece in the second metal fill layer in at least one direction orthogonal to each of the metal fill axes.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: February 10, 2009
    Assignee: International Business Machines Corporation
    Inventors: Steven J. Baumgartner, Chun-Tao Li, Salvatore N. Storino, Mankit Wong
  • Design Structure for a Metal Fill Region of a Semiconductor Chip
    Publication number: 20080082300
    Abstract: A design structure embodied in a machine readable medium used in a design process includes a metal fill region of a semiconductor chip including a plurality of layer sets of the semiconductor chip, each set including a first metal fill layer, a second metal fill layer, and an insulation layer included disposed in planes parallel to each other, a plurality of metal fill pieces disposed in each of the metal fill layers, a metal fill piece axis of each of the pieces, wherein each of the axes perpendicularly intersects the planes of said metal fill layers and the insulation layer from any point of reference, and a metal fill pattern configured to position the pieces so that the axis of each piece in the first metal fill layer is linearly displaced of the axis of each piece in the second metal fill layer in at least one direction orthogonal to each of the metal fill axes.
    Type: Application
    Filed: October 8, 2007
    Publication date: April 3, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven J. Baumgartner, Chun-Tao Li, Salvatore N. Storino, Mankit Wong
  • METAL FILL REGION OF A SEMICONDUCTOR CHIP
    Publication number: 20080079158
    Abstract: Disclosed is a metal fill region of a semiconductor chip including a plurality of layer sets of the semiconductor chip, each set including a first metal fill layer, a second metal fill layer, and an insulation layer included disposed in planes parallel to each other, a plurality of metal fill pieces disposed in each of the metal fill layers, a metal fill piece axis of each of the pieces, wherein each of the axes perpendicularly intersects the planes of said metal fill layers and the insulation layer from any point of reference, and a metal fill pattern configured to position the pieces so that the axis of each piece in the first metal fill layer is linearly displaced of the axis of each piece in the second metal fill layer in at least one direction orthogonal to each of the metal fill axes.
    Type: Application
    Filed: October 3, 2006
    Publication date: April 3, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven J. Baumgartner, Chun-Tao Li, Salvatore N. Storino, Mankit Wong