Patents by Inventor Man-kyo JUNG

Man-kyo JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA
    Publication number: 20100140786
    Abstract: Provided is a semiconductor power module package including a bonding area on a direct bonding cupper (DBC) board. The semiconductor power module package includes: one or more semiconductor chips; a sealing member sealing the one or more semiconductor chips; a plurality of leads electrically connected to the one or more semiconductor chips and exposed from the sealing member; and an external bonding member electrically connected to the one or more semiconductor chips and electrically connecting an external circuit board exposed from the sealing member.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 10, 2010
    Applicant: FAIRCHILD KOREA SEMICONDUCTOR LTD.
    Inventors: Keun-hyuk LEE, Young-sun KO, Seung-won LIM, Man-kyo JUNG, Seung-yong CHOI