Abstract: An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.

Abstract: A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.

Abstract: A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.

Abstract: A chemical supply structure includes a bar-shaped body having a plurality of chemical reservoirs in which a plurality of chemicals is individually stored such that the body partially crosses an underlying substrate, a bar-shaped nozzle protruded from a bottom surface of the body and injecting injection chemicals onto the substrate, a plurality of the chemicals being mixed into the injection chemicals, and a hydrophobic unit arranged on the bottom surface of the body and on a side surface of the nozzle such that a mixed solution mixed with the injection chemicals is prevented from adhering to the bottom surface and the side surface by controlling a contact angle of the mixed solution with respect to the bottom surface and the side surface.

Abstract: An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.

Abstract: Embodiments of the inventive concept relate to a substrate treating apparatus. A substrate support unit configured to support a substrate includes a support plate, on which the substrate is positioned, the support plate may include a passage formed on an upper surface of the support plate and connecting a central area and a side surface of the support plate, and a recess formed in a peripheral area of the support plate and recessed inwards from a side surface of the support plate, and the recess may communicate with one end of the passage.

Abstract: A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.

Abstract: A chemical supply structure includes a bar-shaped body having a plurality of chemical reservoirs in which a plurality of chemicals is individually stored such that the body partially crosses an underlying substrate, a bar-shaped nozzle protruded from a bottom surface of the body and injecting injection chemicals onto the substrate, a plurality of the chemicals being mixed into the injection chemicals, and a hydrophobic unit arranged on the bottom surface of the body and on a side surface of the nozzle such that a mixed solution mixed with the injection chemicals is prevented from adhering to the bottom surface and the side surface by controlling a contact angle of the mixed solution with respect to the bottom surface and the side surface.

Abstract: A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.

Abstract: Embodiments of the inventive concept relate to a substrate treating apparatus. A substrate support unit configured to support a substrate includes a support plate, on which the substrate is positioned, the support plate may include a passage formed on an upper surface of the support plate and connecting a central area and a side surface of the support plate, and a recess formed in a peripheral area of the support plate and recessed inwards from a side surface of the support plate, and the recess may communicate with one end of the passage.

Abstract: A method of fabricating an attenuated phase-shift photomask includes forming a phase-shift material layer on a photomask substrate, forming a light opaque layer on the phase-shift material layer, forming a first resist pattern on the light opaque layer to selectively expose a pattern region, etching the light opaque layer using the first resist pattern as an etch mask, such that a first light opaque pattern layer is formed to selectively expose the phase-shift material layer, removing the first resist pattern, forming a second resist pattern on the light opaque layer, such that a cell pattern block in the pattern region is selectively exposed, and etching the exposed phase-shift material layer using the first light opaque pattern layer as an etch mask to form a phase-shift material pattern layer selectively exposing a top surface of the photomask substrate.