Abstract: This invention is directed to a composition comprising: (a) platinum group metal powder, alloys, or mixtures thereof as a powder or deposited on graphite supports; (b) poly(glycol ether), derivatives, or mixtures thereof; (c) carbon-based electrically conductive filler; and (d) thermoplastic polymer or mixtures thereof. The invention is further directed to a process for dispersing platinum group metal powder, alloys, or mixtures thereof in poly(glycol ether), derivatives, or mixtures thereof. The invention is further directed to the above composition wherein the platinum group metal powder has been dispersed according to the above process.

Abstract: The invention is directed to polymer thick film conductor compositions comprising conductive metal particles selected from the group consisting of finely divided powders of platinum group metals and mixtures thereof or metallized graphite particles; in combination with a thermoplastic polymer and optionally, graphite conductive filler.

Abstract: The invention is directed to polymer thick film conductor compositions comprising conductive metal particles selected from the group consisting of finely divided powders of platinum group metals and mixtures thereof; modified graphite; and a thermoplastic polymer and optionally, graphite and/or a metallized graphite in combination with a surfactant may replace the modified graphite.

Abstract: The invention is directed to a conductive composition for iontophoretic electrodes comprising, based on solids: (a) 20-90% wt finely divided particles of silver, carbon, graphite and mixtures thereof; (b) 0-75% wt. finely divided particles of silver chloride; (c) 0.25-10% wt. hydrophilic polymer; and (d) 2-15% wt. hydrophobic thermoplastic polymer having a glass transition temperature (Tg) >40.degree. C. The invention is also directed to compositions wherein the binder comprises 5-15% wt. copolymer of hydrophilic and hydrophobic monomers.

Abstract: The present invention is a thick film water based conductive coating composition comprising, based on total composition: (a) 5-40% wt. first aqueous dispersion of polyhydroxyether polymer grafted with at least one acrylic or methacrylic monomer wherein the dispersion is 25-40% wt. grafted polymer solids; (b) 20-80% wt. finely divided metallic electrically conductive particles selected from the group consisting of silver, copper, nickel, silver coated copper, silver coated nickel, carbon, graphite and mixtures thereof; (c) 0-20% by wt. second aqueous dispersion of an acrylic or polyurethane polymer wherein the dispersion is 25-40% wt. polymer solids; (d) 0-5% wt. water soluble polymer; and wherein all of (a), (b), (c) and (d) are dispersed in water and about 1-8% wt. co-solvent.

Abstract: The invention is directed to a conductive composition for iontophoretic electrodes comprising, based on solids: (a) 20-90% wt finely divided particles of silver, carbon, graphite and mixtures thereof; (b) 0-75% wt. finely divided particles of silver chloride; (c) 0.25-10% wt. hydrophilic polymer; and (d) 2-15% wt. hydrophobic thermoplastic polymer having a glass transition temperature (Tg)>40.degree. C. The invention is also directed to compositions wherein the binder comprises 5-15% wt. copolymer of hydrophilic and hydrophobic monomers.

Abstract: The present invention relates to silver/silver chloride polymer compositions for use in making electrodes. The composition comprises:(a) 3-15% water dispersible polymer wherein the polymer is an acrylic, urethane or blends;(b) 25-95% Ag;(c) 5-75% AgCl; andwherein (a), (b), and (c) are dispersed in water and at least 1% wt. organic co-solvent.

Abstract: A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin.