Patents by Inventor Man Shing Cheng

Man Shing Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stamped leadframe and method of manufacture thereof
    Patent number: 8174096
    Abstract: A stamped leadframe for a leadless package and a method of manufacturing the same are provided wherein the leadframe has at least a die pad, a frame, tie bars connecting the die pad to the frame and a plurality of leads. Each lead comprises a first portion and a second portion, and the second portion is connected substantially parallel to and displaced relative to the first portion by a distance that is less than the thickness of the first portion. Portions of the tie-bars and/or die pad may be similarly displaced.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: May 8, 2012
    Assignee: ASM Assembly Materials Ltd.
    Inventors: Tat Chi Chan, Man Shing Cheng
  • Stamped leadframe and method of manufacture thereof
    Publication number: 20080122048
    Abstract: A stamped leadframe for a leadless package and a method of manufacturing the same are provided wherein the leadframe has at least a die pad, a frame, tie bars connecting the die pad to the frame and a plurality of leads. Each lead comprises a first portion and a second portion, and the second portion is connected substantially parallel to and displaced relative to the first portion by a distance that is less than the thickness of the first portion. Portions of the tie-bars and/or die pad may be similarly displaced.
    Type: Application
    Filed: August 25, 2006
    Publication date: May 29, 2008
    Inventors: Tat Chi Chan, Man Shing Cheng