Patents by Inventor Man Su BYUN
Man Su BYUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230215648Abstract: A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein AV indicates a total area of the at least one hole, AB indicates an area of the one surface of the first or second bump, facing the first or second external electrode, and AV/AB is greater than 0.012 and less than 0.189.Type: ApplicationFiled: March 29, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su BYUN, Se Hun PARK, Soo Hwan SON, Taek Jung LEE
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Publication number: 20230187139Abstract: A multilayer capacitor includes a body including a laminate structure in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; first and second external electrodes spaced apart from each other and disposed on the body to be connected to the at least one first internal electrode and the at least one second internal electrode, respectively; and a noise reduction insulating layer covering one surface of the body and one surfaces of the first and second external electrodes together.Type: ApplicationFiled: April 7, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Dae Heon Jeong, Soo Hwan Son, Won Chul Sim
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Patent number: 11562858Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes; first and second external electrodes; and an insulator disposed on a first surface of the capacitor body. The capacitor body includes an active region in which first and second internal electrodes overlap each other in a first direction, and upper and lower covers disposed above and below the active region in the first direction. A length of the active region in the second direction is defined as ‘La’, a length of one margin of the capacitor body in the second direction is defined as ‘Lm’, a height of the active region in the first direction is defined as ‘Ta’, a thickness of the lower cover of the capacitor body is defined as ‘Tc’, and a thickness of the insulator is defined as ‘Te’. A relative displacement index, ((La/Lm)?(Ta/Tc))/Te)2, ranges from 0.003 to 0.055.Type: GrantFiled: June 3, 2021Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon Kim, Man Su Byun
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Patent number: 11477891Abstract: An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.Type: GrantFiled: August 11, 2020Date of Patent: October 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gu Won Ji, Man Su Byun, Soo Hwan Son, Young Ghyu Ahn
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Publication number: 20220189695Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes; first and second external electrodes; and an insulator disposed on a first surface of the capacitor body. The capacitor body includes an active region in which first and second internal electrodes overlap each other in a first direction, and upper and lower covers disposed above and below the active region in the first direction. A length of the active region in the second direction is defined as ‘La’, a length of one margin of the capacitor body in the second direction is defined as ‘Lm’, a height of the active region in the first direction is defined as ‘Ta’, a thickness of the lower cover of the capacitor body is defined as ‘Tc’, and a thickness of the insulator is defined as ‘Te’. A relative displacement index, ((La/Lm)?(Ta/Tc))/Te)2, ranges from 0.003 to 0.055.Type: ApplicationFiled: June 3, 2021Publication date: June 16, 2022Inventors: Ho Yoon Kim, Man Su Byun
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Publication number: 20220181084Abstract: The present disclosure provides a multilayer capacitor and a board component having the same. The multilayer capacitor includes: a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first to sixth surfaces; first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively; an insulator disposed on the first surface of the capacitor body; a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction.Type: ApplicationFiled: November 23, 2021Publication date: June 9, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su BYUN, Ho Yoon KIM, Min Kyoung CHEON, Soo Hwan SON, Won Chul SIM
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Patent number: 11276528Abstract: An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.Type: GrantFiled: April 15, 2020Date of Patent: March 15, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Soo Hwan Son
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Patent number: 11206737Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.Type: GrantFiled: April 23, 2020Date of Patent: December 21, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Kyung Hwa Yu, Dae Heon Jeong, Min Kyoung Cheon, Soo Hwan Son
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Patent number: 11166375Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.Type: GrantFiled: November 22, 2019Date of Patent: November 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Kyung Hwa Yu, Dae Heon Jeong, Min Kyoung Cheon, Soo Hwan Son
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Publication number: 20210175019Abstract: An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.Type: ApplicationFiled: April 15, 2020Publication date: June 10, 2021Inventors: Man Su Byun, Ho Yoon Kim, Soo Hwan Son
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Publication number: 20210092847Abstract: An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.Type: ApplicationFiled: August 11, 2020Publication date: March 25, 2021Inventors: Gu Won Ji, Man Su Byun, Soo Hwan Son, Young Ghyu Ahn
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Patent number: 10916376Abstract: An electronic component includes a multilayer capacitor including a capacitor body and an external electrode disposed at an end of the capacitor body, and an interposer including an interposer body and an external terminal disposed at an end of the interposer body. The external terminal includes a bonding portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a connection portion disposed on an end surface of the interposer body to connect the bonding portion and the mounting portion and having an uneven surface, and a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminals, and an adhesive extends to a portion of the uneven surface.Type: GrantFiled: November 26, 2018Date of Patent: February 9, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
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Patent number: 10910163Abstract: A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.Type: GrantFiled: March 26, 2019Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Heon Jeong, Kyung Hwa Yu, Man Su Byun, Min Kyoung Cheon, Soo Hwan Son, Ho Yoon Kim
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Patent number: 10777351Abstract: A complex electronic component includes a body including a first external electrode and a second external electrode, disposed on an external surface thereof and a laminate; a plurality of first electrodes and a plurality of second electrodes, disposed in the laminate and electrically connected to the first external electrode and the second external electrode, respectively; a third electrode and a fourth electrode, disposed on the laminate to be spaced apart from each other and electrically connected to the first external electrode and the second external electrode, respectively; and an ESD discharge layer disposed between the third electrode and the fourth electrode. In addition, a distance between the third electrode and the fourth electrode is within a range of 30 ?m to 60 ?m.Type: GrantFiled: December 16, 2016Date of Patent: September 15, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan Son, Ho Yoon Kim, Man Su Byun
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Publication number: 20200253057Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.Type: ApplicationFiled: April 23, 2020Publication date: August 6, 2020Inventors: Man Su BYUN, Ho Yoon KIM, Kyung Hwa YU, Dae Heon JEONG, Min Kyoung CHEON, Soo Hwan SON
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Patent number: 10699846Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.Type: GrantFiled: May 31, 2018Date of Patent: June 30, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Heon Jeong, Young Ghyu Ahn, Ho Yoon Kim, Man Su Byun, Soo Hwan Son
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Patent number: 10629374Abstract: A composite electronic component includes a composite body including: a multilayer ceramic capacitor including a first ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween and stacked to be perpendicular to a lower surface of the first ceramic body, and a ceramic chip being coupled to the multilayer ceramic capacitor and disposed on a lower portion of the multilayer ceramic capacitor, the ceramic chip including a second ceramic body, first and second terminal electrodes disposed on upper and lower portions of the second ceramic body and connected to the first and second external electrodes, respectively.Type: GrantFiled: June 1, 2018Date of Patent: April 21, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan Son, Young Ghyu Ahn, Man Su Byun
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Publication number: 20200118743Abstract: An electronic component includes a multilayer capacitor including a capacitor body and an external electrode disposed at an end of the capacitor body, and an interposer including an interposer body and an external terminal disposed at an end of the interposer body. The external terminal includes a bonding portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a connection portion disposed on an end surface of the interposer body to connect the bonding portion and the mounting portion and having an uneven surface, and a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminals, and an adhesive extends to a portion of the uneven surface.Type: ApplicationFiled: November 26, 2018Publication date: April 16, 2020Inventors: Man Su BYUN, Ho Yoon KIM, Sang Soo PARK, Woo Chul SHIN
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Publication number: 20200092999Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.Type: ApplicationFiled: November 22, 2019Publication date: March 19, 2020Inventors: Man Su BYUN, Ho Yoon KIM, Kyung Hwa YU, Dae Heon JEONG, Min Kyoung CHEON, Soo Hwan SON
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Patent number: 10542626Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05?A1/A1?0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.Type: GrantFiled: June 6, 2018Date of Patent: January 21, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon Kim, Kyung Hwa Yu, Man Su Byun, Dae Heon Jeong, Min Kyoung Cheon, Soo Hwan Son