Abstract: A module for predicting semiconductor physical defects includes a defect diagnosis unit used to detect at least one failure circuit in a semiconductor circuit structure; an information acquisition unit used for obtaining a semiconductor mask layout for forming the semiconductor circuit structure, and obtaining a failure path configuration diagram corresponding to the failure circuits and the location information corresponding to the failure path configuration diagram; a feature classification unit used for extracting a plurality of cutting images of the failure path configuration diagram, and performing feature classification on these cutting images to obtain a plurality of image groups; and a failure risk assessment unit used for performing a risk pre-assessment to select at least one high-risk group therefrom, and performing a failure risk analysis to predict at least one high failure risk position in the semiconductor mask layout according to the analysis results and the location information.