Abstract: A camera module is manufactured by attaching a lens module to an image sensor. The lens module includes at least one lens element which has a plurality of centers of curvature. A tilt angle of an imaging axis of the image sensor is determined, and a tilt angle of an optical axis of the lens module is also determined by using an optical device to identify locations of multiple centers of curvature of the at least one lens element included in the lens module. At least one of the lens module and the image sensor are then adjusted accordingly so that the imaging axis and the optical axis are aligned, and thereafter, the lens module is fixedly attached with respect to the image sensor to form the camera module.

Abstract: A male touch fastener strip includes an elongated base having a thickness and defining a longitudinal direction and a lateral direction perpendicular to the longitudinal direction across the base between longitudinal edges of the base, and a field of male fastener elements each having a stem extending from a broad face of the base and a head at an upper end of the stem and overhanging the base for engaging fibers. The fastener element stems and broad face of the base together form a unitary mass of resin. The male touch fastener strip also includes a pair of longitudinal barrier walls rising from the broad face of the base on either side of the field of male fastener elements, and a plurality of lateral barrier walls. Each of the lateral barrier walls extends between facing surfaces of the longitudinal barrier walls to define a longitudinal column of bounded fastening cells that each contain one or more male fastener elements.

Abstract: A male touch fastener strip includes an elongated base having a thickness and defining a longitudinal direction and a lateral direction perpendicular to the longitudinal direction across the base between longitudinal edges of the base, and a field of male fastener elements each having a stem extending from a broad face of the base and a head at an upper end of the stem and overhanging the base for engaging fibers. The fastener element stems and broad face of the base together form a unitary mass of resin. The male touch fastener strip also includes a pair of longitudinal barrier walls rising from the broad face of the base on either side of the field of male fastener elements, and a plurality of lateral barrier walls. Each of the lateral barrier walls extends between facing surfaces of the longitudinal barrier walls to define a longitudinal column of bounded fastening cells that each contain one or more male fastener elements.

Abstract: A male touch fastener strip includes an elongated base and a field of male fastener elements. The male touch fastener strip also includes longitudinal barrier walls rising from the broad face of the base on either side of the field of male fastener elements, and a pair of segmented walls. Each segmented wall and its nearest longitudinal barrier wall define therebetween a foam relief space. Each segmented wall defines a flow gap for allowing the foam material to enter the foam relief space.

Abstract: A wave powered generating device includes a floating vessel with onboard pendulum mechanism, an anchor with a mooring chain connected with the vessel, a lever arm, an upstanding post having a tip connected with the lever arm and a foot coupled with a universal coupler, a pendulum moveably mounted on the lever arm being erected above a platform deck of the vessel by the upstanding post, a gear mechanism incorporating with a centrifugal flywheel coupled with the universal coupler via a transmission mechanism for delivery of momentum of the pendulum, and a power generating mechanism driven by the gear mechanism. Under undulating waves, the pendulum, being mounted on the lever arm, sways laterally around an axis of the upstanding post, causing the upstanding post to rotate hence delivering the momentum of the pendulum to drive the power generating mechanism via a transmission shaft and the gear mechanism.

Abstract: A wave powered generating device includes a floating vessel with onboard pendulum mechanism, an anchor with a mooring chain connected with the vessel, a lever arm, an upstanding post having a tip connected with the lever arm and a foot coupled with a universal coupler, a pendulum moveably mounted on the lever arm being erected above a platform deck of the vessel by the upstanding post, a gear mechanism incorporating with a centrifugal flywheel coupled with the universal coupler via a transmission mechanism for delivery of momentum of the pendulum, and a power generating mechanism driven by the gear mechanism. Under undulating waves, the pendulum, being mounted on the lever arm, sways laterally around an axis of the upstanding post, causing the upstanding post to rotate hence delivering the momentum of the pendulum to drive the power generating mechanism via a transmission shaft and the gear mechanism.

Abstract: A system and method for distributing signals from a first communications network and a second communications network to a location, including a base transceiver station configured to receive a signal from the first communications network and convert the signal into an RF signal for transmission to a mobile terminal, the RF signal having an RF frequency above a threshold frequency, and a coupling module configured to: receive the RF signal from the base transceiver station and receive a data signal from the second communications network, the data signal having an RF frequency below the threshold frequency; combine the RF signal and the data signal into a combined signal with the RF signal and data signal each retaining their respective frequencies; and provide the combined signal over a coaxial cable link to the location.

Abstract: A vertically interleaved in-building distributed antenna system is described. The in-building distributed antenna system includes a multiple-input and multiple-output (MIMO) radio. The MIMO radio includes a first branch connector and a second branch connector. The in-building distributed antenna system further includes a first branch transport medium coupled to the first branch connector and a second branch transport medium coupled to the second branch connector. The in-building distributed antenna system further includes a plurality of antennas. The plurality of antennas includes one or more first branch antennas coupled to the first branch transport medium and one or more second branch antennas coupled to the second branch transport medium. The first branch antennas are vertically interleaved with the second branch antennas in the structure.

Abstract: A vertically interleaved in-building distributed antenna system is described. The in-building distributed antenna system includes a multiple-input and multiple-output (MIMO) radio. The MIMO radio includes a first branch connector and a second branch connector. The in-building distributed antenna system further includes a first branch transport medium coupled to the first branch connector and a second branch transport medium coupled to the second branch connector. The in-building distributed antenna system further includes a plurality of antennas. The plurality of antennas includes one or more first branch antennas coupled to the first branch transport medium and one or more second branch antennas coupled to the second branch transport medium. The first branch antennas are vertically interleaved with the second branch antennas in the structure.

Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.

Abstract: A system and method for distributing signals from a first communications network and a second communications network to a location, including a base transceiver station configured to receive a signal from the first communications network and convert the signal into an RF signal for transmission to a mobile terminal, the RF signal having an RF frequency above a threshold frequency, and a coupling module configured to: receive the RF signal from the base transceiver station and receive a data signal from the second communications network, the data signal having an RF frequency below the threshold frequency; combine the RF signal and the data signal into a combined signal with the RF signal and data signal each retaining their respective frequencies; and provide the combined signal over a coaxial cable link to the location.

Abstract: A vertically interleaved in-building distributed antenna system is described. The in-building distributed antenna system includes a multiple-input and multiple-output (MIMO) radio. The MIMO radio includes a first branch connector and a second branch connector. The in-building distributed antenna system further includes a first branch transport medium coupled to the first branch connector and a second branch transport medium coupled to the second branch connector. The in-building distributed antenna system further includes a plurality of antennas. The plurality of antennas includes one or more first branch antennas coupled to the first branch transport medium and one or more second branch antennas coupled to the second branch transport medium. The first branch antennas are vertically interleaved with the second branch antennas in the structure.

Abstract: A semiconductor die is attached onto a substrate on a process platform during manufacturing of a semiconductor package. A dispenser dispenses an adhesive onto the substrate, and the semiconductor die is bonded onto the adhesive which has been dispensed onto the substrate with a bonding tool. Thereafter, a bond line thickness between a bottom surface of the semiconductor die and a top surface of the substrate on the process platform is measured using a measuring device.

Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Abstract: A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.

Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Abstract: An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly for supporting the object in the heating chamber for heating. The heating assembly and support assembly are configured to be movable relative to one another for controllably positioning the object at variable distances with respect to the heating assembly. Heating of the object according to a heating profile can thus be achieved by controlled heating of the object at different temperatures by positioning the object at different distances with respect to the heating assembly during the heating process although there is a single heating zone.

Abstract: Fluid dispensing apparatus for dispensing small precise metered quantities of fluid, for example in a semiconductor manufacturing process, comprises two metering chambers disposed in series. Each metering chamber has an associated piston rod and fluid is dispensed therefrom alternately. Twice the volume of fluid is displaced from the upstream metering chamber so that when it dispenses fluid at the same time it can refill the second downstream metering chamber.