Abstract: A sterilization apparatus includes a housing; a sterilization unit for irradiating, with sterilization light, at least one region to be sterilized; and a driving unit for moving the sterilization unit into and out of the housing via an opening of the housing and rotating the sterilization unit about a rotation axis.

Abstract: Apparatus for and a method of cleaning or processing a wafer anticipates a malfunction of a pump and avoids an abrupt shutting down of the pump during the cleaning or processing of the wafer. The apparatus includes a tank vessel containing a liquid used in the cleaning or processing of the wafer, a pump that pumps the liquid chemical from the vessel, a filter that filters impurities contained in the liquid pumped by the pump, a heater that heats the filtered liquid to a predetermined temperature and supplies the heated liquid back into the tank vessel, and a pump malfunction anticipation unit that operates at the same time as the pump. The pump malfunction anticipation unit calculates the flow rate of the liquid pumped by the pump using a program, and based on the flow rate anticipates when it is time to replace the pump.

Abstract: There is provided a method and system for transferring wafers. Wafers in a FOUP are horizontally aligned by vibrating the FOUP before unloading the wafers from the FOUP. Thereafter, a mapping process may be accurately performed, and the wafers stably unloaded from the FOUP.

Abstract: An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.

Abstract: A wet processing apparatus includes a bath in which a plurality of semiconductor substrates are to be seated, and which bath has drain valves defining drain openings between a bottom wall and the lower portions of side walls of the bath. Each of the drain valves also includes a gate mounted on the lower portion of one of the side walls. The gates of the drain valves are movable to selectively open and close the drain openings. A plurality of substrates are transferred into the bath and are held under a body of liquid contained in a bath while the substrates are oriented vertically as disposed generally parallel to one another. In this state, the side walls of the baths face the peripheral edges of the substrates at both sides of the substrates. Thus, the substrates are prevented from moving toward and becoming stuck to one another when the liquid is drained from the bath.

Abstract: A wafer guide and a semiconductor wafer drying apparatus using the same are disclosed. The wafer guide includes a body and supporters formed on the body. The supporters present a plurality of grooves to engage and support a periphery of a wafer. A discharge structure, e.g., a discharging hole, promotes flow of a cleaning solution away from the grooves thereby more effectively drying the wafer by more readily discharging the cleaning solution by way of the discharging structure. The discharging structure reduces undesirable accumulation of the cleaning solution, such as deionized water, in the grooves during a wafer cleaning process. In some embodiments, a pump actively draws fluid away from the discharge structure.

Abstract: Rinsing and drying apparatus having rotatable drying source nozzles and methods of rinsing and drying semiconductor wafers are provided. The apparatus includes a bath for storing liquid and rotatable nozzles disposed over the bath. The semiconductor wafers are rinsed using de-ionized water inside the bath. After the rinsing process, de-ionized water is drained. A drying source is then sprayed onto the semiconductor wafers through the rotatable nozzles. The nozzles are oscillated and/or rotated while the drying source is sprayed.

Abstract: An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.

Abstract: Apparatus for and a method of cleaning or processing a wafer anticipates a malfunction of a pump and avoids an abrupt shutting down of the pump during the cleaning or processing of the wafer. The apparatus includes a tank vessel containing a liquid used in the cleaning or processing of the wafer, a pump that pumps the liquid chemical from the vessel, a filter that filters impurities contained in the liquid pumped by the pump, a heater that heats the filtered liquid to a predetermined temperature and supplies the heated liquid back into the tank vessel, and a pump malfunction anticipation unit that operates at the same time as the pump. The pump malfunction anticipation unit calculates the flow rate of the liquid pumped by the pump using a program, and based on the flow rate anticipates when it is time to replace the pump.

Abstract: A semiconductor wafer drying apparatus is provided. In one embodiment, this apparatus includes a bath which can contain much deionized water so that semiconductor wafers soak in the deionized water; a chamber providing a space where vapor flows over the bath; a vapor supply line supplying vapor to the internal space of the chamber; an exhaust line discharging vapor contained in the chamber; a deionized water exhaust line discharging deionized water in the bath; a semiconductor wafer holder supporting the semiconductor wafer in the bath; and pitch guides placed at left and right sides of the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.

Abstract: A semiconductor wafer drying apparatus is provided. In one embodiment, this apparatus includes a bath which can contain much deionized water so that semiconductor wafers soak in the deionized water; a chamber providing a space where vapor flows over the bath; a vapor supply line supplying vapor to the internal space of the chamber; an exhaust line discharging vapor contained in the chamber; a deionized water exhaust line discharging deionized water in the bath; a semiconductor wafer holder supporting the semiconductor wafer in the bath; and pitch guides placed at left and right sides of the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.

Abstract: An error correction method and apparatus for correcting multiple errors in received digital data word signals calculates syndromes S.sub.0, S.sub.1, S.sub.2 and S.sub.3 from a block of n received data words and a parity check matrix H. First coefficients .sigma..sub.1 and .sigma..sub.2 are calculated from the derived syndromes and a second coefficient K is calculated from the first coefficients .sigma..sub.1 and .sigma..sub.2. An error location value x.sub.1 is calculated from the second coefficient K, actual error location values X.sub.1 and X.sub.2 are calculated from the value x.sub.1, and error values Y.sub.1 and Y.sub.2 are calculated from the actual error location values X.sub.1 and X.sub.2. The received data words are then corrected by applying the calculated error values Y.sub.1 and Y.sub.2. The error location value x.sub.1 calculator is preferably constituted by logic gates which enable the apparatus to be smaller and faster than those using a conventional ROM table.

Abstract: An operation method and apparatus over Galois Field GF(2.sup.m) using a subfield GF(2.sup.m/2). The operation apparatus includes a conversion circuit for converting the elements represented by a basis of GF(2.sup.m) into the elements represented by a basis of GF(2.sup.m/2); an operation circuit for performing an operation over GF(2.sup.m/2) with respect to the elements represented by the basis of GF(2.sup.m/2); and a reversion circuit for reverting the operated elements represented by the basis of GF(2.sup.m/2) to the elements represented by the basis of GF(2.sup.m), thereby performing high speed operation and simplifying circuit construction.