Patents by Inventor Mana Eritate

Mana Eritate has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10322549
    Abstract: Disclosed herein is a processing method for forming a plurality of quadrangular prisms on a plate-shaped substrate having a product area. The processing method includes the steps of preparing an excess-sized plate-shaped substrate having an excess area surrounding the product area, cutting the excess-sized plate-shaped substrate in a first direction by using a cutting blade to thereby form a first cut groove extending in the first direction, cutting the excess-sized plate-shaped substrate in a second direction perpendicular to the first direction by using the cutting blade to thereby form a second cut groove extending in the second direction, filling the first cut groove and the second cut groove with a resin, and cutting the excess-sized plate-shaped substrate along the boundary between the product area and the excess area by using the cutting blade to thereby remove the excess area from the excess-sized plate-shaped substrate.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: June 18, 2019
    Assignee: Disco Corporation
    Inventors: Shigenori Harada, Mana Eritate
  • Publication number: 20170113420
    Abstract: Disclosed herein is a processing method for forming a plurality of quadrangular prisms on a plate-shaped substrate having a product area. The processing method includes the steps of preparing an excess-sized plate-shaped substrate having an excess area surrounding the product area, cutting the excess-sized plate-shaped substrate in a first direction by using a cutting blade to thereby form a first cut groove extending in the first direction, cutting the excess-sized plate-shaped substrate in a second direction perpendicular to the first direction by using the cutting blade to thereby form a second cut groove extending in the second direction, filling the first cut groove and the second cut groove with a resin, and cutting the excess-sized plate-shaped substrate along the boundary between the product area and the excess area by using the cutting blade to thereby remove the excess area from the excess-sized plate-shaped substrate.
    Type: Application
    Filed: October 17, 2016
    Publication date: April 27, 2017
    Inventors: Shigenori Harada, Mana Eritate