Patents by Inventor Mana OKI

Mana OKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICURED PRODUCT COMPLEX AND METHOD FOR PRODUCING SAME, CURED PRODUCT COMPLEX AND METHOD FOR PRODUCING SAME, AND THERMOSETTING COMPOSITION USED TO IMPREGNATE POROUS BODY
    Publication number: 20230122917
    Abstract: An aspect of the present invention provides a semi-cured product composite containing: a porous body; and a semi-cured product of a thermally curable composition impregnated in the porous body, wherein the thermally curable composition contains an epoxy compound and a cyanate compound, and an equivalent ratio of an epoxy group of the epoxy compound to a cyanate group of the cyanate compound in the thermally curable composition is 1.0 or more.
    Type: Application
    Filed: March 29, 2021
    Publication date: April 20, 2023
    Applicant: Denka Company Limited
    Inventors: Eri KANEKO, Mana OKI, Saori INOUE, Kohji TSUJI
  • COMPOSITE, METHOD FOR PRODUCING COMPOSITE, LAMINATE, AND METHOD FOR PRODUCING LAMINATE
    Publication number: 20220194870
    Abstract: The present disclosure provides a composite including a nitride sintered body having a porous structure and a semi-cured product of a heat-curable composition impregnated into the nitride sintered body, wherein a dielectric breakdown voltage obtainable after disposing the composite between adherends, heating and pressurizing the composite for 5 minutes under the conditions of 200° C. and 10 MPa, and further heating the composite for 2 hours under the conditions of 200° C. and atmospheric pressure, is greater than 5 kV.
    Type: Application
    Filed: March 25, 2020
    Publication date: June 23, 2022
    Applicant: Denka Company Limited
    Inventors: Yoshitaka MINAKATA, Eri SASAKI, Saori INOUE, Mana OKI