Patents by Inventor Mana TANABE

Mana TANABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096653
    Abstract: According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 21, 2024
    Inventors: Kensuke DEMURA, Satoshi NAKAMURA, Masaya KAMIYA, Minami NAKAMURA, Kosuke TAKAI, Mana TANABE, Kaori UMEZAWA
  • Publication number: 20240096652
    Abstract: According to an embodiment, a substrate processing method includes forming a liquid film on a substrate including a first region provided with a first film on an outermost surface thereof and a second region provided with a second film on an outermost surface thereof, the first film and the second film being different from each other in material. The method further includes forming a solidified film by solidifying the liquid film. The method further includes causing the solidified film on the first region to melt prior to the solidified film on the second region.
    Type: Application
    Filed: June 13, 2023
    Publication date: March 21, 2024
    Applicant: Kioxia Corporation
    Inventors: Mana TANABE, Kaori UMEZAWA, Kosuke TAKAI
  • Publication number: 20220384218
    Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.
    Type: Application
    Filed: August 10, 2022
    Publication date: December 1, 2022
    Inventors: Mana TANABE, Kosuke TAKAI, Kenji MASUI, Kaori UMEZAWA
  • Publication number: 20210242042
    Abstract: According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.
    Type: Application
    Filed: April 23, 2021
    Publication date: August 5, 2021
    Inventors: Kosuke TAKAI, Mana TANABE, Hideaki SAKURAI
  • Publication number: 20200294822
    Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.
    Type: Application
    Filed: August 30, 2019
    Publication date: September 17, 2020
    Inventors: Mana TANABE, Kosuke TAKAI, Kenji MASUI, Kaori UMEZAWA
  • Publication number: 20200078833
    Abstract: According to one embodiment, a substrate processing method includes supplying a liquid on a first face of a substrate, forming a solidified layer in which at least part of the liquid has been solidified by cooling the substrate down to be equal to or lower than a solidification point of the liquid, and melting the solidified layer. Forming the solidified layer, includes controlling a cooling parameter by monitoring an optical characteristic or acoustic wave characteristic of the solidified layer.
    Type: Application
    Filed: March 8, 2019
    Publication date: March 12, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Kosuke TAKAI, Mana TANABE, Hideaki SAKURAI
  • Publication number: 20200078834
    Abstract: According to one embodiment, a first liquid is supplied on a first face of a substrate. The first liquid has a pH with which a surface zeta potential of the substrate becomes negative and a surface zeta potential of a foreign substance attaching to the first face becomes positive. Then, a solidified layer in which at least part of the first liquid has been solidified is formed by cooling the substrate down to be equal to or lower than a solidification point of the first liquid. Thereafter, the solidified layer is melted.
    Type: Application
    Filed: March 12, 2019
    Publication date: March 12, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Mana TANABE, Hideaki Sakurai, Kosuke Takai, Kyo Otsubo, Minako Inukai
  • Publication number: 20190278167
    Abstract: A method of manufacturing a replica template includes preparing a substrate including a first protruding portion protruding from a first surface of the substrate and having a patterning surface thereon, forming a first mask pattern over the patterning surface, the first mask pattern comprising a convex portion having a smaller width than the patterning surface and a pattern disposed on the convex portion, removing a portion of the first protruding portion using the first mask pattern as a mask to produce a second protruding portion on the first protruding portion, and forming a pattern in the patterning surface on the second protruding portion by transferring the shape of the pattern of the first mask pattern into the patterning surface on the second protruding portion.
    Type: Application
    Filed: August 21, 2018
    Publication date: September 12, 2019
    Inventors: Mana TANABE, Shingo KANAMITSU
  • Publication number: 20190221452
    Abstract: According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.
    Type: Application
    Filed: August 31, 2018
    Publication date: July 18, 2019
    Inventors: Kosuke TAKAI, Mana TANABE, Hideaki SAKURAI