Abstract: A wireless power transfer system includes a wireless terminal apparatus, a wireless power transmitter, and a wireless base station (a wide-area base station and a narrow-area base station). The wireless base station creates schedule information containing allocation of wireless resources regarding the wireless data communication and the wireless power transfer on the basis of grasp of a request of the wireless data communication and a request of the wireless power transfer from the wireless terminal apparatus, and transmits the schedule information to the wireless power transmitter and the wireless terminal apparatus. The wireless power transmitter executes the wireless power transfer to the wireless terminal apparatus in accordance with the schedule information. The wireless terminal apparatus receives the wireless power transfer from the wireless power transmitter in accordance with the schedule information, and executes the wireless data communication via the wireless base station.

Abstract: Provided is an insulating film for electronic components which can attain a good matte feeling and has excellent visibility of a marker. The insulating film for electronic components is an insulating film for electronic components having a front surface and a back surface, in which a maximum peak height Rp (?m) and the maximum valley depth Rv (?m) of the front surface satisfy the following relational expressions: 0.5?Rv/Rp?2 and 1?Rp+Rv?4. It is also an insulating film for electronic components, in which the 85° gloss Gs (85°) and the 60° gloss Gs (60°) of the front surface satisfy the following relational expression: Gs (85°)?2Gs (60°); and Gs (85°) is 70 or more and Gs (60°) is 30 or less.

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Abstract: [Problems] The present invention provides a photocurable resin composition having excellent adhesion with a substrate and excellent resolution; a film obtained by using the photocurable resin composition; a cured product obtained by curing the photocurable resin composition; and a printed wiring board comprising the cured product. [Means for Solution] The photocurable resin composition according to the present invention is characterized by comprising (A) a carboxyl group-containing resin, (B) an acylphosphine oxide-based photopolymerization initiator, (C) a titanocene-based photopolymerization initiator, (D) a photosensitive monomer and (E) a polymerization inhibitor.

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.