Patents by Inventor Manabu Amikura

Manabu Amikura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210035823
    Abstract: A substrate processing device for processing a substrate is provided. The substrate processing device includes: a processing container configured to accommodate a substrate; a placement stage on which the substrate is mounted in the processing container; an exhauster configured to exhaust a processing gas in the processing container; and a partition wall disposed in the processing container and surrounding the placement stage, wherein, inside the partition wall, an exhaust flow path, which communicates with the exhauster, is formed to extend in a vertical direction over an entire circumference of the partition wall, and a plurality of openings, which communicates with a substrate processing space formed inside the partition wall above the placement stage and communicates with the exhaust flow path, is formed at regular intervals in an inner circumferential direction of the partition wall.
    Type: Application
    Filed: November 16, 2018
    Publication date: February 4, 2021
    Inventors: Yuji ASAKAWA, Manabu AMIKURA
  • Patent number: 10526702
    Abstract: A film forming apparatus includes: a mounting table that is lifted/lowered between a processing location and a delivery location below the processing location; an encompassing member for encompassing the mounting table positioned at the processing location and to divide an inside of a processing container into a processing space of an upper space and a space of a lower side; an exhaust part for evacuating the inside of the processing container through the processing space; a purge gas supply unit configured to supply a purge gas to the lower side space; a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location; and a guiding part formed at the encompassing member to be extended between an upper side of the mounting table and a lower side of the clamp ring and to guide a flow of the purge gas.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: January 7, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Daisuke Toriya, Eiichi Komori, Manabu Amikura
  • Publication number: 20190006207
    Abstract: A substrate processing apparatus includes a processing container configured to air-tightly accommodate substrates, a plurality of mounting stands configured to mount the substrates, a process gas supply part configured to supply a process gas to the mounting stands, an exhaust mechanism configured to evacuate an interior of the processing container, a partition wall configured to independently surround the mounting stands with a gap left between the partition wall and each of the mounting stands, and cylindrical inner walls configured to independently surround the mounting stands with a gap left between each of the inner walls and each of the mounting stands. Slits are formed in the inner walls. The process gas in the processing spaces is exhausted via the slits. The inner walls include partition plates for bypassing the process gas so that the process gas does not directly flow into the slits.
    Type: Application
    Filed: August 28, 2018
    Publication date: January 3, 2019
    Inventors: Manabu AMIKURA, Toshiki HINATA
  • Patent number: 10096495
    Abstract: A substrate processing apparatus includes a processing container configured to air-tightly accommodate substrates, a plurality of mounting stands configured to mount the substrates, a process gas supply part configured to supply a process gas to the mounting stands, an exhaust mechanism configured to evacuate an interior of the processing container, a partition wall configured to independently surround the mounting stands with a gap left between the partition wall and each of the mounting stands, and cylindrical inner walls configured to independently surround the mounting stands with a gap left between each of the inner walls and each of the mounting stands. Slits are formed in the inner walls. The process gas in the processing spaces is exhausted via the slits. The inner walls include partition plates for bypassing the process gas so that the process gas does not directly flow into the slits.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: October 9, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Manabu Amikura, Toshiki Hinata
  • Patent number: 10094019
    Abstract: A film forming apparatus that includes a mounting table for loading a wafer, a encompassing member surrounding the mounting table and dividing an inside of a process container, an exhaust part that vacuum exhausts the process container, a clamp ring loaded upon an upper space of the encompassing member and lifted from the upper space of the encompassing member while contacting an inner circumference part thereof with an outer circumference of the wafer loaded on the mounting table, and a cylindrical wall extended downward from the clamp ring, formed along a circumference of the clamp ring into a cylinder shape, and positioned between an outer circumference surface of the mounting table and an inner circumference surface of the encompassing member.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: October 9, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Daisuke Toriya, Eiichi Komori, Manabu Amikura
  • Publication number: 20160355928
    Abstract: A film forming apparatus includes: a mounting table that is lifted/lowered between a processing location and a delivery location below the processing location; an encompassing member for encompassing the mounting table positioned at the processing location and to divide an inside of a processing container into a processing space of an upper space and a space of a lower side; an exhaust part for evacuating the inside of the processing container through the processing space; a purge gas supply unit configured to supply a purge gas to the lower side space; a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location; and a guiding part formed at the encompassing member to be extended between an upper side of the mounting table and a lower side of the clamp ring and to guide a flow of the purge gas.
    Type: Application
    Filed: August 22, 2016
    Publication date: December 8, 2016
    Inventors: Daisuke TORIYA, Eiichi KOMORI, Manabu AMIKURA
  • Publication number: 20160189987
    Abstract: A substrate processing apparatus includes a processing container configured to air-tightly accommodate substrates, a plurality of mounting stands configured to mount the substrates, a process gas supply part configured to supply a process gas to the mounting stands, an exhaust mechanism configured to evacuate an interior of the processing container, a partition wall configured to independently surround the mounting stands with a gap left between the partition wall and each of the mounting stands, and cylindrical inner walls configured to independently surround the mounting stands with a gap left between each of the inner walls and each of the mounting stands. Slits are formed in the inner walls. The process gas in the processing spaces is exhausted via the slits. The inner walls include partition plates for bypassing the process gas so that the process gas does not directly flow into the slits.
    Type: Application
    Filed: December 16, 2015
    Publication date: June 30, 2016
    Inventors: Manabu AMIKURA, Toshiki HINATA
  • Publication number: 20140130743
    Abstract: A film forming apparatus that includes a mounting table for loading a wafer, a encompassing member surrounding the mounting table and dividing an inside of a process container, an exhaust part that vacuum exhausts the process container, a clamp ring loaded upon an upper space of the encompassing member and lifted from the upper space of the encompassing member while contacting an inner circumference part thereof with an outer circumference of the wafer loaded on the mounting table, and a cylindrical wall extended downward from the clamp ring, formed along a circumference of the clamp ring into a cylinder shape, and positioned between an outer circumference surface of the mounting table and an inner circumference surface of the encompassing member.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 15, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Daisuke TORIYA, Eiichi KOMORI, Manabu AMIKURA
  • Patent number: 8143557
    Abstract: To provide a plane heater, including a carbon wire heating element CW, in which surface arrangement density of the heating element CW in an outer area is denser than that in an inner area. A power supply terminal unit having connection wires for supplying electricity to the heating element CW is arranged in the center on the back side of a silica glass plate-like member 2. Connection wires 4a and 4b connected with the heating element CW in the inner area are connected with the heating element in the inner area in the center of the silica glass plate-like member. Connection wires 3a and 3b connected with the heating element in the outer area are extended from the center of the silica glass plate-like member toward the outer area and connected with the heating element CW in the outer area, without intersecting the heating element CW in the inner area.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: March 27, 2012
    Assignees: Covalent Materials Corporation, Tokyo Electron Limited
    Inventors: Kazuo Shibata, Hiroo Kawasaki, Teruo Iwata, Manabu Amikura
  • Publication number: 20110283942
    Abstract: A film forming apparatus includes: a chamber for holding a wafer; a susceptor on which the wafer is placed within the chamber; heaters which heat the wafer placed on the susceptor; and a shower plate disposed opposite to the susceptor to inject a film formation processing gas toward the wafer, a main body of the shower plate being made of aluminum or an aluminum alloy. With the apparatus, a film is deposited on the surface of the wafer, the film having a low thermal expansion coefficient, measured at the film deposition temperature, lower by at least about 5×10?6/° C. than a thermal expansion coefficient of the main body of the shower plate. The shower plate has an anodized film having a thickness of 10 ?m or thicker formed on the side of the main body facing the susceptor.
    Type: Application
    Filed: July 29, 2011
    Publication date: November 24, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Teruo IWATA, Ryo KUWAJIMA, Manabu AMIKURA, Tsuyoshi HASHIMOTO, Hiroaki UCHIDA
  • Patent number: 7931749
    Abstract: The present invention relates to a showerhead that supplies a source gas and a supporting gas for depositing a film into a processing vessel of a film deposition apparatus. The showerhead includes a body which is provided with a gas jetting surface (8). In the showerhead body, there are defined a first diffusion chamber (60) that receives the source gas and diffuses the same, and a second diffusion chamber (62) that receives the supporting gas and diffuses the same. The gas jetting surface has source-gas jetting orifices (10A) that are in communication with the first diffusion chamber, and first supporting-gas jetting orifices (10B) that are in communication with the second diffusion chamber. Each of the first supporting-gas jetting orifices (10B) are formed into a ring shape that adjacently surrounds a corresponding one of the source-gas jetting orifices (10A).
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: April 26, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Manabu Amikura, Teruo Iwata
  • Publication number: 20100224620
    Abstract: [Problem to be Solved] To provide a plane heater including a carbon wire heating element which has an arrangement pattern allowing a heating surface to be a substantially uniform heating temperature plane. [Means to Solve Problem] Surface arrangement densities of a carbon wire heating element CW are different in an inner area and an outer area located in the periphery. The surface arrangement density in the above-mentioned outer area is denser than the surface arrangement density in the inner area. A power supply terminal unit 8 having connection wires for supplying electricity to the above-mentioned heating element CW is arranged in the center on the back side of the above-mentioned silica glass plate-like member 2. The connection wires 4a and 4b connected with the carbon wire heating element in the above-mentioned inner area are connected with the carbon wire heating element CW in the inner area in the center of the above-mentioned silica glass plate-like member.
    Type: Application
    Filed: February 7, 2007
    Publication date: September 9, 2010
    Applicants: COVALENT MATERIALS CORPORATION, TOKYO ELECTRON LIMITED
    Inventors: Kazuo Shibata, Hiroo Kawasaki, Teruo Iwata, Manabu Amikura
  • Patent number: 7718930
    Abstract: A thermal processing system has a processing vessel 4, a support post 30 stood on the bottom wall of the processing vessel 4, and a support table 32 internally provided with a heating means 38 and supported on the support post 30. A workpiece W is placed on the upper surface of the support table 32 and is subjected to a predetermined thermal process. The upper, the side and the lower surface of the support table 32 are covered with heat-resistant covering members 72, 74 and 76 to prevent the thermal diffusion of metal atoms causative of contamination from the support table 32. thus, various types of contamination, such as metal and organic contamination, can be prevented.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: May 18, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Hiroo Kawasaki, Teruo Iwata, Manabu Amikura
  • Patent number: 7651584
    Abstract: A shower head structure (26) includes a shower head main body (78) of a one-piece structure formed in a generally cup shape and having a bottom wall (78A) provided with a plurality of gas injection holes (30A, 30B) formed therein and a side wall (78B) rising from a peripheral portion of the bottom wall. A plurality of gas diffusion chamber forming plates (82A-82C) are housed in the shower head main body (78). A through-hole is formed in a head mounting frame (76) disposed on a ceiling of a processing vessel (24). An upper portion of the side wall (78B) of the shower head main body (78) is inserted into the through-hole, so that a part of the side wall (78B) is exposed to the exterior of the processing vessel. A cooling mechanism (84) is disposed at the upper end portion of the side wall (78B).
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: January 26, 2010
    Assignee: Tokyo Electron Limited
    Inventor: Manabu Amikura
  • Publication number: 20070272154
    Abstract: The present invention relates to a showerhead that supplies a source gas and a supporting gas for depositing a film into a processing vessel of a film deposition apparatus. The showerhead includes a body which is provided with a gas jetting surface (8). In the showerhead body, there are defined a first diffusion chamber (60) that receives the source gas and diffuses the same, and a second diffusion chamber (62) that receives the supporting gas and diffuses the same. The gas jetting surface has source-gas jetting orifices (10A) that are in communication with the first diffusion chamber, and first supporting-gas jetting orifices (10B) that are in communication with the second diffusion chamber. Each of the first supporting-gas jetting orifices (10B) are formed into a ring shape that adjacently surrounds a corresponding one of the source-gas jetting orifices (10A).
    Type: Application
    Filed: October 22, 2004
    Publication date: November 29, 2007
    Inventors: Manabu Amikura, Teruo Iwata
  • Publication number: 20070158026
    Abstract: A shower head structure (26) includes a shower head main body (78) of a one-piece structure formed in a generally cup shape and having a bottom wall (78A) provided with a plurality of gas injection holes (30A, 30B) formed therein and a side wall (78B) rising from a peripheral portion of the bottom wall. A plurality of gas diffusion chamber forming plates (82A-82C) are housed in the shower head main body (78). A through-hole is formed in a head mounting frame (76) disposed on a ceiling of a processing vessel (24). An upper portion of the side wall (78B) of the shower head main body (78) is inserted into the through-hole, so that a part of the side wall (78B) is exposed to the exterior of the processing vessel. A cooling mechanism (84) is disposed at the upper end portion of the side wall (78B).
    Type: Application
    Filed: January 14, 2005
    Publication date: July 12, 2007
    Inventor: Manabu Amikura
  • Publication number: 20060199131
    Abstract: A thermal processing system has a processing vessel 4, a support post 30 stood on the bottom wall of the processing vessel 4, and a support table 32 internally provided with a heating means 38 and supported on the support post 30. A workpiece W is placed on the upper surface of the support table 32 and is subjected to a predetermined thermal process. The upper, the side and the lower surface of the support table 32 are covered with heat-resistant covering members 72, 74 and 76 to prevent the thermal diffusion of metal atoms causative of contamination from the support table 32. thus, various types of contamination, such as metal and organic contamination, can be prevented.
    Type: Application
    Filed: April 7, 2004
    Publication date: September 7, 2006
    Inventors: Hiroo Kawasaki, Teruo Iwata, Manabu Amikura
  • Publication number: 20050223987
    Abstract: A film forming apparatus according to the present invention has a source material supply section, a vaporizer, and a film forming chamber. The vaporizer comprises a nozzle which spays the liquid material supplied from the source material supply section, a vaporization chamber which has one end in which the nozzle opens and a closed other end and in which the misty liquid material sprayed through the nozzle is vaporized to generate the material gas, a heater which heats the vaporization chamber, and an outlet port which opens in the vaporization chamber in the vicinity of the nozzle and through which the material gas is discharged from the vaporization chamber. The closed other end of the vaporization chamber is kept at a long enough distance from the nozzle to allow the liquid source material injected through the nozzle to vaporize.
    Type: Application
    Filed: February 10, 2005
    Publication date: October 13, 2005
    Inventors: Teruo Iwata, Manabu Amikura, Munehisa Futamura, Tsuyoshi Takahashi