Abstract: A wireless sensor system capable of operating with low power and capable of perming long-distance and high-speed data transmission includes a plurality of sensor nodes acquiring prescribed measurement data and a relay spot receiving measurement data relay-transmitted among the sensor nodes and transmitting the measurement data to a given communication device (for example, a gateway) by a LPWA (Low Power Wide Area) communication. A switching operation between a reception side (Central) and a transmission side (Peripheral) is performed in an asynchronous manner among the sensor nodes performing transmission and reception of the measurement data.

Abstract: To provide a solder material capable of performing soldering with high reliability while suppressing materials other than a solder metal to remain inside the solder after the soldering. Coil-shaped carbons are heated by electromagnetic waves by using a solder material in which coil-shaped carbons of 0.5 weight % to 1.5 weight % with respect to a weight of a solder paste are mixed, thereby performing soldering by heating the solder material itself.

Abstract: A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.

Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.

Abstract: To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

Abstract: A stacked structure of semiconductor chips includes plural stacked semiconductor chips and plural tabular holding members which hold the respective semiconductor chips.

Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.

Abstract: A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.

Abstract: To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

Abstract: A semiconductor stack device having semiconductor chips stacked therein, wherein pads 4d of an uppermost semiconductor chip 2d are disposed on the side of a base substrate 1, and the pads 4d of the semiconductor chip 2d and electrodes 8d of the base substrate 1 are connected to each other via a flexible substrate 5 having circuit components 7 mounted thereon.

Abstract: A stacked structure of semiconductor chips includes plural stacked semiconductor chips and plural tabular holding members which hold the respective semiconductor chips.