Patents by Inventor Manabu Gotoh

Manabu Gotoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240337856
    Abstract: A standard-light generator for straightness measurement has a light source, and a light shielding plate disposed at a position irradiated with light from the light source. The light shielding plate has a circular-ring-shaped light transparency slit. The light source is disposed on a slit axis through the center of the circumference of the light transparency slit and perpendicular to the light shielding plate, and directed so that the whole area of the light transparency slit is irradiated with light from the light source. In measuring straightness, observed are irradiances by diffraction light waves from the light transparency slit on a first, second and third observation planes respectively different in distance to to light shielding plate. Each position of each irradiance peak due to interference of the diffraction light waves is specified.
    Type: Application
    Filed: April 9, 2024
    Publication date: October 10, 2024
    Applicant: ADTEC Engineering Co., Ltd.
    Inventors: Yoneta TANAKA, Manabu GOTOH
  • Patent number: 5075718
    Abstract: With an exposure apparatus according to the present invention, it is possible to project an image of a mask in a any large number onto a band-shaped film sequentially in a longitudinal direction with high precisions in position, magnification and focus. Thus, the apparatus can be provided for fabrication of an FPC film of a high circuit density.
    Type: Grant
    Filed: November 21, 1990
    Date of Patent: December 24, 1991
    Assignee: Ushio Denki
    Inventors: Shigeru Suzuki, Kazuya Tanaka, Manabu Gotoh
  • Patent number: 4899195
    Abstract: A method of exposing a peripheral part of wafer is used for a fine pattern formation process in the processing of ICs, LSIs and other electronics elements, to remove, in a development step, an unncessary portion of a photoresist coated on a semiconductor substrate, typically a silicon wafer, or a substrate consisting of a dielectric, a metal or an insulator, from a peripheral part of the substrate.In the method for exposing a peripheral part of wafer, the wafer edge is detected using a sensor, and the light emission end of an optical fiber lightguide is controlled to expose a fixed distance from the edge of wafer according to a signal from the sensor. It is thus possible to expose a peripheral part of wafer having a predetermined width with high accuracy. In addition, the wafer centering mechanism and orientation flat detection/positioning mechanism employed in the prior art are unncessary.
    Type: Grant
    Filed: December 21, 1988
    Date of Patent: February 6, 1990
    Assignee: Ushio Denki
    Inventor: Manabu Gotoh