Patents by Inventor Manabu Ichinose

Manabu Ichinose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board and structure using the same
    Patent number: 8350161
    Abstract: According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other. The line portion includes lead portions through which a current is to flow and an opening portion arranged between the lead portions. The opening portion penetrates the conductive layer in a thickness direction.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: January 8, 2013
    Assignee: Kycera Corporation
    Inventors: Kimihiro Yamanaka, Manabu Ichinose, Satoshi Nakamura
  • Circuit board and structure using the same
    Patent number: 8253027
    Abstract: According to one embodiment of the invention, a circuit board comprises a conductive layer including a land portion and a line portion connected to the land portion, and; a conductor connected to a surface of the land portion. A planar shape of the connected portion between the conductor and the land portion has a elongated shape along a width direction of the line portion. A part of the connected portion is located within an imaginary region formed by imaginarily extending the line portion toward the land portion.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: August 28, 2012
    Assignee: Kyocera Corporation
    Inventors: Kimihiro Yamanaka, Manabu Ichinose, Satoshi Nakamura
  • Circuit Board and Structure Using the Same
    Publication number: 20100212947
    Abstract: According to one embodiment of the invention, a circuit board comprises a conductive layer including a land portion and a line portion connected to the land portion, and; a conductor connected to a surface of the land portion. A planar shape of the connected portion between the conductor and the land portion has a elongated shape along a width direction of the line portion. A part of the connected portion is located within an imaginary region formed by imaginarily extending the line portion toward the land portion.
    Type: Application
    Filed: February 24, 2010
    Publication date: August 26, 2010
    Applicant: KYOCERA CORPORATION
    Inventors: Kimihiro YAMANAKA, Manabu ICHINOSE, Satoshi NAKAMURA
  • Circuit Board and Structure Using the Same
    Publication number: 20100193231
    Abstract: According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other. The line portion includes lead portions through which a current is to flow and an opening portion arranged between the lead portions. The opening portion penetrates the conductive layer in a thickness direction.
    Type: Application
    Filed: January 29, 2010
    Publication date: August 5, 2010
    Applicant: KYOCERA CORPORATION
    Inventors: Kimihiro YAMANAKA, Manabu ICHINOSE, Satoshi NAKAMURA
  • Tank covers and ships
    Patent number: 7520232
    Abstract: The fatigue strength of a bottom end part jointed to an upper deck of a hull is sufficiently maintained to thereby improve fatigue life. In a tank cover which covers a protruding part of an independent spherical tank loaded in a ship with one part protruding above an upper deck of a hull, a bottom end part to be jointed to the upper deck is provided with a reinforced part which is reinforced for strength. The reinforced part is a thickened part with a thickness greater than a thickness of an other part. The reinforced part is provided on both ends in a direction along the width direction of the hull.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: April 21, 2009
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Satoshi Miyazaki, Hiroshi Shirakihara, Koichi Sato, Manabu Ichinose