Patents by Inventor Manabu Ikoma

Manabu Ikoma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical fiber and manufacturing method thereof
    Patent number: 9523818
    Abstract: An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10?15 seconds to 10?11 seconds.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: December 20, 2016
    Assignee: OMRON Corporation
    Inventors: Satoshi Hirono, Naoto Inoue, Manabu Ikoma, Kiyohiko Gondo, Tsuyoshi Miyata, Kazunari Komai
  • Optical semiconductor package, optical semiconductor module, and manufacturing method of these
    Patent number: 9006750
    Abstract: An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: April 14, 2015
    Assignee: OMRON Corporation
    Inventors: Satoshi Hirono, Manabu Ikoma, Naoto Inoue, Tsuyoshi Miyata, Kazunari Komai
  • OPTICAL FIBER AND MANUFACTURING METHOD THEREOF
    Publication number: 20140056558
    Abstract: An optical fiber has an incident end on which light is incident, an emitting end from which the light is emitted, and an aperture provided in a core located at or near the emitting end. The aperture is formed by irradiating the core with an ultrashort pulsed laser beam having pulse widths of 10?15 seconds to 10?11 seconds.
    Type: Application
    Filed: March 22, 2011
    Publication date: February 27, 2014
    Applicant: OMRON CORPORATION
    Inventors: Satoshi Hirono, Naoto Inoue, Manabu Ikoma, Kiyohiko Gondo, Tsuyoshi Miyata, Kazunari Komai
  • OPTICAL SEMICONDUCTOR PACKAGE, OPTICAL SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF THESE
    Publication number: 20140042478
    Abstract: An optical semiconductor package has a base material that includes a principal surface, an optical semiconductor element that is located on the principal surface of the base material to project or receive light, and an optical transparency sealing layer that seals the optical semiconductor element while covering the principal surface of the base material. An air gap having a shape surrounding an optical axis of the optical semiconductor element is provided in the optical transparency sealing layer such that the light is reflected by an interface of a portion corresponding to an inner circumferential surface of the air gap in an interface formed by the air gap and the optical transparency sealing layer.
    Type: Application
    Filed: March 22, 2011
    Publication date: February 13, 2014
    Applicant: OMRON CORPORATION
    Inventors: Satoshi Hirono, Manabu Ikoma, Naoto Inoue, Tsuyoshi Miyata, Kazunari Komai