Patents by Inventor Manabu Kaneko
Manabu Kaneko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10647828Abstract: This prepreg comprises reinforcing fibers and a matrix resin composition. The matrix resin composition comprises at least an epoxy resin (component (A)), a radical polymerizable unsaturated compound (component (B)), and a polymer formed by radical polymerization of the component (B) (component (E)).Type: GrantFiled: September 5, 2013Date of Patent: May 12, 2020Assignee: Mitsubishi Chemical CorporationInventors: Takuya Teranishi, Manabu Kaneko, Masahiro Ichino, Teppei Miura, Tadao Samejima, Akira Miyauchi, Kiharu Numata, Shouhei Mori, Masaki Kusumi
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Patent number: 10501618Abstract: Provided are an epoxy resin composition which contains an epoxy resin and a curing agent, and satisfies the following (1), (2), and (3): (1) the bending elastic modulus of a cured product of the epoxy resin composition is 3.3 GPa or higher; (2) the bending strain at break of the cured product of the epoxy resin composition is 9% or higher; and (3) the fiber-reinforced plastic ? formed of the cured product of the epoxy resin composition and a reinforcing fiber substrate in which carbon fibers, which are continuous fibers, are evenly aligned in one direction has 90° bending strength of 95 MPa or higher, and a film, a prepreg, and fiber-reinforced plastic that are produced by using the epoxy resin composition.Type: GrantFiled: December 2, 2014Date of Patent: December 10, 2019Assignee: Mitsubishi Chemical CorporationInventors: Tomoko Ishimoto, Manabu Kaneko, Tetsuya Atsumi, Kenichi Watanabe
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Patent number: 10364347Abstract: To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), “R” is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons).Type: GrantFiled: March 22, 2012Date of Patent: July 30, 2019Assignee: Mitsubishi Chemical CorporationInventors: Masao Tomioka, Manabu Kaneko, Miyuki Hagiwara
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Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition
Patent number: 10227476Abstract: The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C. and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G?Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.Type: GrantFiled: November 29, 2012Date of Patent: March 12, 2019Assignee: Mitsubishi Chemical CorporationInventors: Yasuhiro Fukuhara, Hisaya Ushiyama, Manabu Kaneko -
Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same
Patent number: 9994697Abstract: The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), R1 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, R2 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.Type: GrantFiled: November 29, 2012Date of Patent: June 12, 2018Assignee: Mitsubishi Chemical CorporationInventors: Yasuhiro Fukuhara, Hisaya Ushiyama, Manabu Kaneko -
Patent number: 9988508Abstract: An epoxy-resin composition of the components (A), (B), (D) and (E), where component (A) is an epoxy resin having an oxazolidone-ring structure, (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not have an oxazolidone-ring structure, (D) is a triblock copolymer, and (E) is a curing agent. A film made of the epoxy-resin composition, a prepreg and a fiber-reinforced plastic is also disclosed. The epoxy resin composition is capable of achieving both a processability of a prepreg at room temperature and a suppression of voids in the molded product. A fiber-reinforced plastic having excellent mechanical properties, especially excellent fracture toughness and heat tolerance, is also obtained by using the epoxy-resin composition.Type: GrantFiled: August 20, 2013Date of Patent: June 5, 2018Assignee: MITSUBISHI CHEMICAL CORPORATIONInventors: Tomoko Ishimoto, Manabu Kaneko, Kenichi Watanabe, Yasuhiro Fukuhara, Sanae Kita
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Patent number: 9701815Abstract: A resin composition that has good heat resistance and handleability and that can produce a prepreg which has a good balance between tackyness and drapability and which causes little resin flow during prepreg molding, a prepreg that is manufactured using the resin composition, and a fiber-reinforced composite are provided. A resin composition that contains a maleimide compound, diallyl bisphenol A, and a diallyl isophthalate polymer, a prepreg in which reinforcing fibers are impregnated with the resin composition, and a fiber-reinforced composite material that is obtained by molding the prepreg are provided.Type: GrantFiled: July 26, 2011Date of Patent: July 11, 2017Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Yukihiro Harada, Manabu Kaneko, Tomoo Sano, Kazutami Mitani
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Patent number: 9574081Abstract: The present invention relates to an epoxy-resin composition comprising the following components (A), (B), (C) and (D), a film made of the epoxy resin composition, a prepreg and a fiber-reinforced plastic. The present invention can provide an epoxy-resin composition that cures at a low temperature in a short period of time. Also, the present invention can provide a fiber-reinforced plastic having excellent mechanical characteristics, especially excellent fracture toughness and heat tolerance, is made from the epoxy-resin composition. component (A): an epoxy resin having a monomer unit represented by formula (1) in the molecule; component (B): a bifunctional epoxy resin with a number-average molecular weight of at least 600 but no greater than 1300, which does not have a monomer unit represented by formula (1) below in the molecule; component (C): a triblock copolymer; and component (D): a curing agent.Type: GrantFiled: August 20, 2013Date of Patent: February 21, 2017Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Tomoko Ishimoto, Manabu Kaneko, Kenichi Watanabe, Yasuhiro Fukuhara, Sanae Kita
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Patent number: 9481789Abstract: The present invention relates to a method for producing a prepreg which contains reinforcing fibers and a matrix resin composition with the weight per square meter of the reinforcing fibers being 250-2,000 g/m2. The production method comprises the following steps (1)-(3): (1) a matrix resin composition blending step for obtaining a matrix resin composition by mixing an epoxy resin, a radically polymerizable unsaturated compound, an epoxy resin curing agent and a polymerization initiator that generates radicals, in said step the content of the radically polymerizable unsaturated compound relative to 100% by mass of the total of the epoxy resin and the radically polymerizable unsaturated compound being 10-25% by mass; (2) a matrix resin composition impregnating step; and (3) a surface viscosity increasing step.Type: GrantFiled: March 2, 2012Date of Patent: November 1, 2016Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Masahiro Ichino, Manabu Kaneko, Kazuki Koga, Teppei Miura, Takuya Teranishi, Kiharu Numata, Kazutami Mitani, Tadao Samejima
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Publication number: 20160297959Abstract: Provided are an epoxy resin composition which contains an epoxy resin and a curing agent, and satisfies the following (1), (2), and (3): (1) the bending elastic modulus of a cured product of the epoxy resin composition is 3.3 GPa or higher; (2) the bending strain at break of the cured product of the epoxy resin composition is 9% or higher; and (3) the fiber-reinforced plastic ? formed of the cured product of the epoxy resin composition and a reinforcing fiber substrate in which carbon fibers, which are continuous fibers, are evenly aligned in one direction has 90° bending strength of 95 MPa or higher, and a film, a prepreg, and fiber-reinforced plastic that are produced by using the epoxy resin composition.Type: ApplicationFiled: December 2, 2014Publication date: October 13, 2016Applicant: MITSUBISHI RAYON CO., LTD.Inventors: Tomoko ISHIMOTO, Manabu KANEKO, Tetsuya ATSUMI, Kenichi WATANABE
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Patent number: 9416219Abstract: Provided is an RTM moldable chain curing resin composition which can be molded with less energy in a short time, and which makes it possible to obtain a cured product that is superior in mechanical strength. A chain curing resin composition of the present invention includes an alicyclic epoxy compound (A) having two cyclohexene oxides in a molecule and a specific modified bisphenol A-type epoxy resin (B), and the content of the alicyclic epoxy compound (A) is 25 to 90% by mass, when the total of the component (A) and the component (B) is taken as 100% by mass.Type: GrantFiled: October 4, 2010Date of Patent: August 16, 2016Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Atsushi Nohara, Manabu Kaneko, Noriya Hayashi
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Publication number: 20150337099Abstract: A prepreg comprising an epoxy resin (A), a boron chloride-amine complex (B) and a fiber base material (C) is used. Preferably, the molar ratio of boron in the boron chloride-amine complex (B) is 4-7 mol % with respect to the number of moles of epoxy groups in the epoxy resin (A), and the epoxy resin (A) includes a bifunctional epoxy resin with an oxazolidone ring structure, a bisphenol-type epoxy resin and a phenol-novolac-type epoxy resin.Type: ApplicationFiled: July 29, 2015Publication date: November 26, 2015Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Manabu Kaneko, Tomoko Ishimoto, Kaori Usami
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Publication number: 20150328828Abstract: A prepreg comprising an epoxy resin (A), a boron chloride-amine complex (B) and a fiber base material (C) is used. Preferably, the molar ratio of boron in the boron chloride-amine complex (B) is 4-7 mol % with respect to the number of moles of epoxy groups in the epoxy resin (A), and the epoxy resin (A) includes a bifunctional epoxy resin with an oxazolidone ring structure, a bisphenol-type epoxy resin and a phenol-novolac-type epoxy resin.Type: ApplicationFiled: July 29, 2015Publication date: November 19, 2015Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Manabu KANEKO, Tomoko ISHIMOTO, Kaori USAMI
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Publication number: 20150252160Abstract: This prepreg comprises reinforcing fibers and a matrix resin composition. The matrix resin composition comprises at least an epoxy resin (component (A)), a radical polymerizable unsaturated compound (component (B)), and a polymer formed by radical polymerization of the component (B) (component (E)).Type: ApplicationFiled: September 5, 2013Publication date: September 10, 2015Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Takuya Teranishi, Manabu Kaneko, Masahiro Ichino, Teppei Miura, Tadao Samejima, Akira Miyauchi, Kiharu Numata, Shouhei Mori, Masaki Kusumi
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Publication number: 20150191592Abstract: The present invention relates to An epoxy-resin composition comprising the following components (A), (B), (C) and (D), a film made of the epoxy resin composition, a prepreg and a fiber-reinforced plastic. The present invention can provide an epoxy-resin composition that cures at a low temperature in a short period of time. Also, the present invention can provide a fiber-reinforced plastic having excellent mechanical characteristics, especially excellent fracture toughness and heat tolerance, is made from the epoxy-resin composition. component (A): an epoxy resin having a monomer unit represented by formula (1) in the molecule; component (B): a bifunctional epoxy resin with a number-average molecular weight of at least 600 but no greater than 1300, which does not have a monomer unit represented by formula (1) below in the molecule; component (C): a triblock copolymer; and component (D): a curing agent.Type: ApplicationFiled: August 20, 2013Publication date: July 9, 2015Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Tomoko Ishimoto, Manabu Kaneko, Kenichi Watanabe, Yasuhiro Fukuhara, Sanae Kita
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Publication number: 20150175760Abstract: An epoxy-resin composition of the components (A), (B), (D) and (E), where component (A) is an epoxy resin having an oxazolidone-ring structure, (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not have an oxazolidone-ring structure, (D) is a triblock copolymer, and (E) is a curing agent. A film made of the epoxy-resin composition, a prepreg and a fiber-reinforced plastic is also disclosed. The epoxy resin composition is capable of achieving both a processability of a prepreg at room temperature and a suppression of voids in the molded product. A fiber-reinforced plastic having excellent mechanical properties, especially excellent fracture toughness and heat tolerance, is also obtained by using the epoxy-resin composition.Type: ApplicationFiled: August 20, 2013Publication date: June 25, 2015Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Tomoko Ishimoto, Manabu Kaneko, Kenichi Watanabe, Yasuhiro Fukuhara, Sanae Kita
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Patent number: 9051485Abstract: Provided is an inkjet ink which can form high-quality images with high abrasion resistance and adhesiveness on a non-absorptive recording medium and which exhibits high ejection properties and excellent storage stability. Also provided is an inkjet recording method. An inkjet ink which comprises water, a pigment, a water-soluble resin, a water-soluble or Panic solvent and a surfactant, characterized in that: the water-soluble resin comprises a water-soluble resin consisting of a copolymer resin which has an acid value of 50 to 130 mgKOH/g, a glass transition temperature (Tg) of 30 to 100° C.Type: GrantFiled: April 8, 2011Date of Patent: June 9, 2015Assignee: KONICA MINOLTA, INC.Inventors: Manabu Kaneko, Hidenobu Ohya, Naoko Nakajima
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Publication number: 20150099832Abstract: The present invention relates to an epoxy resin composition which comprises a phosphorus-containing modified epoxy resin (A) consisting of a compound (a) represented by Formula (a); a novolak epoxy resin (B); a hardener (C) for epoxy resins; and a metal hydroxide (D), wherein the content in mass % of the phosphorus-containing modified epoxy resin (A), CA, and the content in mass % of the metal hydroxide (D), CD, relative to the total amount of the epoxy resin composition, satisfy the following Formulas (1), (2), and (3): (1) 2.5CA+CD?45; (2) 6?CA?40; and (3) 3?CD?30. This epoxy resin composition can give a composite material which has excellent flame retardancy even when neither a halogenated flame retardant, nor red phosphorus, nor a phosphoric acid ester is contained therein. According to the invention, it is also possible to provide a prepreg and a fiber-reinforced composite material obtained using the prepreg.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Masao Tomioka, Manabu Kaneko, Kazutami Mitani
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Patent number: 8974863Abstract: A method for producing a fiber-reinforced composite material having high mechanical properties and high heat resistance, and allowing the use of a gypsum die in primary curing, wherein a fiber-reinforced prepreg, obtained by impregnating reinforcing fibers with an epoxy resin composition comprising a triphenylmethane-type epoxy resin, N,N,N?,N?-tetraglycidyldiaminodiphenylmethane (B) and diaminodiphenylsulfone (C), is subjected to primary curing at 110-130° C., and then to secondary curing at a temperature which is at least as high as the primary curing temperature.Type: GrantFiled: October 1, 2010Date of Patent: March 10, 2015Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Teppei Miura, Manabu Kaneko
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PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, METHOD FOR PRODUCING SAME, AND EPOXY RESIN COMPOSITION
Publication number: 20140273693Abstract: The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G?Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.Type: ApplicationFiled: November 29, 2012Publication date: September 18, 2014Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Yasuhiro Fukuhara, Hisaya Ushiyama, Manabu Kaneko