Abstract: A printing apparatus includes a medium support unit including a support surface configured to support a medium, a head configured to eject liquid, a first moving unit configured to move the head in a first direction, a second moving unit configured to move the head in a second direction, a position adjusting unit configured to adjust a distance between the head and the support surface, a first interference detection unit configured to detect interference with the head, and a second interference detection unit configured to detect interference with the head. The first interference detection unit and the second interference detection unit are linked to the movement of the head in the second direction. The first interference detection unit is provided further on one side than the head in the second direction. The second interference detection unit is provided further on the other side than the head in the second direction.

Abstract: An oscillator includes: an outer package having an accommodation space; an inner package accommodated in the accommodation space and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a heat generation element accommodated in the accommodation space and fixed to the inner package; an oscillation circuit configured to oscillate the vibration element; a control circuit disposed outside the accommodation space and configured to control the heat generation element; and a conductive wire electrically coupling the outer package and the inner package.

Abstract: An oscillator includes a second container as a container in which a vibrator is accommodated, a base substrate on which the second container is mounted, three or more protruding portions provided on the base substrate at positions overlapping the second container in a plan view, and a bonding member configured to bond the second container and at least one of the protruding portions.

Abstract: A resonator device includes a container accommodating a resonator component and a base substrate on which the container is mounted. The base substrate includes a recess overlapping the container in plan view and forming a space with the container, a first bonding portion overlapping the container in plan view and bonded to the container via a first adhesive, and a first wiring pattern provided such that the first bonding portion is disposed between the recess and the first wiring pattern in plan view.

Abstract: An electronic component includes: a substrate including a flexible wiring board having a first surface and a second surface that are in a front and back relationship, and a support plate having a first opening and joined to the first surface of the flexible wiring board; and a first component and a second component both disposed on the substrate. The substrate includes a first region in which the first surface extends along a first direction and a second direction orthogonal to each other, a second region that is disposed on one side of the first region in the first direction and in which the first surface extends along a third direction orthogonal to the first direction and the second direction, and a first coupling region that is located between the first region and the second region and is bent such that a support plate side is located inside. The first component is attached to the first surface in the first region via the first opening. The second component is attached to the second region.

Abstract: An oscillator includes a first resonator element, a first package that accommodates the first resonator element, a relay substrate on which the first package is mounted, a heater element that is attached to the first package or the relay substrate, a second package that accommodates the first package, and a heat insulating member that is provided at least between the second package and the relay substrate or between the relay substrate and the first package.

Abstract: An oscillator includes: a first resonator element, a first package that accommodates the first resonator element and includes a base and a lid, a heater element that is attached to the first package, a second package that accommodates the first package, a control circuit element that is bonded to a surface of the base of the first package on a side opposite to the lid and is configured to control the heater element, and a first heat insulating member that is provided between the lid of the first package and the second package.

Abstract: An oscillator includes a first resonator element, a first package that accommodates the first resonator element, a relay substrate on which the first package is mounted, a heater element that is attached to the first package or the relay substrate, a second package that accommodates the first package, and a heat insulating member that is provided at least between the second package and the relay substrate or between the relay substrate and the first package.

Abstract: A polycrystalline silicon block fracture device includes a fracturing part mechanically fracturing a polycrystalline silicon block material to produce a polycrystalline silicon fragment including a polycrystalline silicon powder having a particle size of 500 to 1000 ?m then discharging from a discharging port; a falling movement part continuous with a downstream of the fracturing part allowing said polycrystalline silicon fragment discharged from the discharging port to fall by gravity; a receiver part positioned at downstream of the falling movement part and receives the polycrystalline silicon fragment after falling through the falling movement part; and the falling movement part includes a suction removing part in which at least part of the polycrystalline silicon powder included in the polycrystalline silicon fragment is removed by suctioning to a different direction from falling direction; the suction removing part suctions at a suction rate of 1 to 20 m3/min.

Abstract: An oscillator includes: an outer package; an inner package accommodated in the outer package and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a temperature sensor; a first circuit element accommodated in the inner package and including an oscillation circuit configured to oscillate the vibration element and generate a temperature-compensated oscillation signal based on the temperature sensor; and a second circuit element fixed to the outer package and including a frequency control circuit configured to control a frequency of the oscillation signal.

Abstract: An oscillator includes a second container as a container in which a vibrator is accommodated, a base substrate on which the second container is mounted, three or more protruding portions provided on the base substrate at positions overlapping the second container in a plan view, and a bonding member configured to bond the second container and at least one of the protruding portions.

Abstract: An oscillator includes: an outer package; an inner package accommodated in the outer package and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a temperature sensor; a first circuit element accommodated in the inner package and including an oscillation circuit configured to oscillate the vibration element and generate a temperature-compensated oscillation signal based on the temperature sensor; and a second circuit element fixed to the outer package and including a frequency control circuit configured to control a frequency of the oscillation signal.

Abstract: An oscillator includes: an outer package having an accommodation space; an inner package accommodated in the accommodation space and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a heat generation element accommodated in the accommodation space and fixed to the inner package; an oscillation circuit configured to oscillate the vibration element; a control circuit disposed outside the accommodation space and configured to control the heat generation element; and a conductive wire electrically coupling the outer package and the inner package.

Abstract: An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.

Abstract: An electro-optical apparatus has an element substrate that is provided with a mirror and a sealing member which seals the mirror, and the sealing member includes a light-transmitting cover which faces the mirror opposite from the element substrate. An infrared cut filter is laminated on the light-transmitting cover.

Abstract: An oscillator includes a first package including a first base, and a first lid bonded to the first base, a first temperature controller housed in the first package, and mounted on the first base, a second temperature controller housed in the first package, and mounted on the first base, and a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit, the circuit element is disposed between the first temperature controller and the second temperature controller in a planar view.

Abstract: An oscillator includes a case that has a base and a cap connected to the base; a first substrate accommodated in the case; a lead terminal electrically connected to the first substrate; and a resonator module electrically connected to the lead terminal and supported by the lead terminal with a gap with respect to the first substrate between the first substrate and the base.

Abstract: A vibrator includes a first substrate, a first lead frame provided in the first substrate, a package supported by the first lead frame, and a vibrating element housed in the package, in which the first lead frame has a first part coupled to the first substrate, a second part coupled to the package, and a third part coupling the first part with the second part, and including a curved portion, the first substrate has a first side and a second side opposite to each other in plan view, and a plurality of the first lead frames are provided at a side of the first side along the first side and provided at a side of the second side along the second side.

Abstract: A quartz crystal oscillator as an electronic component includes a base section as a first substrate having a lower surface as a first surface, a first lead terminal connected to the first surface, and a second lead terminal connected to the first surface, and the first lead terminal and the second lead terminal intersect each other when viewed in a first direction along the first surface.

Abstract: An oscillator includes a container, a first heater disposed in a first area of the container, a second heater disposed in a second area of the container that is different from the first area, a vibrator disposed between the first area and the second area when viewed in the direction perpendicular to a surface on which the first heater is disposed, and a layer that is disposed between the vibrator and the container with at least part of the layer overlapping with the first heater, the second heater, and the vibrator when viewed in the direction perpendicular to the surface on which the first heater is disposed, and the thermal conductivity of the layer is higher than the thermal conductivity of the first and second areas.