Patents by Inventor Manabu Miyawaki
Manabu Miyawaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11315899Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m?n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].Type: GrantFiled: April 17, 2020Date of Patent: April 26, 2022Assignees: LINTEC CORPORATION, NICHIA CORPORATIONInventors: Akiko Umeda, Manabu Miyawaki, Hidekazu Nakayama, Hiroki Inoue, Toshifumi Imura
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Patent number: 10920117Abstract: The invention is a curable composition comprising the following component (A) and component (B): Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1): R1—D—SiO3/2??(a-1) Component (B): a silane coupling agent having a nitrogen atom in its molecule, and a method for producing the curable composition, and a cured product obtained by curing the curable composition, and a method for using the curable composition as an adhesive for an optical element-fixing material, and a method for using the curable composition as a sealant for an optical element-fixing material, and an optical device obtained by using the curable composition as an adhesive or a sealant for an optical element-fixing material. One aspect of the curable composition according to one embodiment of the invention can provide a cured product excellent in adhesiveness and heat resistance and having a low refractive index.Type: GrantFiled: December 21, 2016Date of Patent: February 16, 2021Assignee: LINTEC CORPORATIONInventors: Yutaka Nanashima, Hidekazu Nakayama, Manabu Miyawaki, Mikihiro Kashio
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Publication number: 20200335471Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position. Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2 ??(a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m-n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].Type: ApplicationFiled: April 17, 2020Publication date: October 22, 2020Applicant: LINTEC CorporationInventors: Akiko UMEDA, Manabu MIYAWAKI, Hidekazu NAKAYAMA, Hiroki INOUE, Toshifumi IMURA
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Patent number: 10385076Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.Type: GrantFiled: August 8, 2017Date of Patent: August 20, 2019Assignees: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
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Publication number: 20180355111Abstract: The invention is a curable composition comprising the following component (A) and component (B): Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1): R1—D—SiO3/2??(a-1) Component (B): a silane coupling agent having a nitrogen atom in its molecule, and a method for producing the curable composition, and a cured product obtained by curing the curable composition, and a method for using the curable composition as an adhesive for an optical element-fixing material, and a method for using the curable composition as a sealant for an optical element-fixing material, and an optical device obtained by using the curable composition as an adhesive or a sealant for an optical element-fixing material. One aspect of the curable composition according to one embodiment of the invention can provide a cured product excellent in adhesiveness and heat resistance and having a low refractive index.Type: ApplicationFiled: December 21, 2016Publication date: December 13, 2018Applicant: LINTEC CORPORATIONInventors: Yutaka NANASHIMA, Hidekazu NAKAYAMA, Manabu MIYAWAKI, Mikihiro KASHIO
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Publication number: 20170334933Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.Type: ApplicationFiled: August 8, 2017Publication date: November 23, 2017Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shuukichi TAKII, Shigeru MICHIWAKI, Manabu MIYAWAKI, Masanori YANAI, Kouichi KAMIYAMA, Hitomi CHIBA, Yasuyuki MASUDA
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Patent number: 9790242Abstract: A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: the compound (?) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3?n, or —N{Rb—Si(Rc)n(ORd)3?n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.Type: GrantFiled: August 31, 2012Date of Patent: October 17, 2017Assignees: Sulfur Chemical Laboratory, Inc.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
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Patent number: 9593423Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: GrantFiled: March 18, 2014Date of Patent: March 14, 2017Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
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Publication number: 20150152124Abstract: Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: said compound (?) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.Type: ApplicationFiled: August 31, 2012Publication date: June 4, 2015Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
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Publication number: 20140227539Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: ApplicationFiled: March 18, 2014Publication date: August 14, 2014Applicants: Kunio Mori, Sulfur Chemical Institute Incorporated, MEIKO ELECTRONICS CO., LTD.Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shigeru MICHIWAKI, Manabu MIYAWAKI
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Patent number: 8753748Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: GrantFiled: September 30, 2011Date of Patent: June 17, 2014Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
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Publication number: 20130183534Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.Type: ApplicationFiled: September 30, 2011Publication date: July 18, 2013Applicants: Kunio Mori, Meiko Electronics Co., Ltd., Sulfur Chemical Institute IncorporatedInventors: Kunio Mori, Yusuke Matsuno, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
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Patent number: D307911Type: GrantFiled: October 24, 1986Date of Patent: May 15, 1990Assignee: Kubota, Ltd.Inventors: Manabu Miyawaki, Takao Katayama, Jinnosuke Takakura, Hirofumi Sadagane, Hisato Katoh
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Patent number: D310189Type: GrantFiled: September 23, 1987Date of Patent: August 28, 1990Assignees: Kubota, Ltd., Kyowa, Ltd.Inventors: Jinnosuke Takakura, Manabu Miyawaki, Norio Yoshikawa