Abstract: The present invention provides a thermally conductive pressure-sensitive adhesive composition comprising an acrylic (or methacrylic) ester copolymer obtained by polymerizing a monomer mixture comprising an acrylic (or methacrylic) estermonomer capable of forming a homopolymer having a glass transition temperature of ?20° C. or lower, a monomer having an organic acid group, and a monomer copolymerizable with these monomers in the presence of a copolymer comprising acrylic (or methacrylic) ester monomer units capable of forming a homopolymer having a glass transition temperature of ?20° C.

Abstract: The invention provides an olefin resin composition for powder molding comprising 100 parts by weight of an olefin resin (A) having a glass transition temperature of 25° C. or lower such as a propylene homopolymer or hydrogenated styrene-butadiene block copolymer and 0.5 to 30 parts by weight of a non-halogen type thermoplastic resin (B) such as methyl methacrylate having a glass transition temperature of 60 to 200° C., an average particle diameter of 0.1 to 10 &mgr;m and a sphericity of 0.8 to 1.0. The resin composition is very excellent in powder flowability and can be easily molten even under conditions where there is little or no pressure or shear stress action, and so best suited for use as powder slush molding compositions.

Abstract: Provided is a vinyl chloride resin composition for powder molding comprising:(1) 100 parts by weight of a vinyl chloride resin powder having an average polymerization degree p of 600 to 3000 and an internal pore volume of 0.20 ml/g or more,(2) 80 to 150 parts by weight of a trimellitic ester having an alkyl group with a principal chain having an average carbon number n of 6 to 9, and(3) 5 to 25 parts by weight of a fine vinyl chloride resin having an average polymerization degree q of 400 to 1300 and a primary grain size distribution of two modes in which a smaller mode falls in a grain size range of 0.1 to 0.4 .mu.m and a larger mode falls in a grain size range of 0.9 to 1.4 .mu.m,wherein the parts by weight L of the trimellitic ester shown in (2), p and n each described above have the relation satisfying an equation (I):5<[{(n-8).times.5+L}/p].times.100<12 (I)This vinyl chloride resin composition is improved in a coldproof property and a thermal degradation resistance.