Patents by Inventor Manabu Onuma

Manabu Onuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7618877
    Abstract: In a semiconductor wafer including a plurality of element forming regions formed on a front surface of a semiconductor substrate, a scribe line groove is formed along a periphery of the each of the element forming regions, and stoppers are located at an intersection of the scribe line groove, so as to block the scribe line groove.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: November 17, 2009
    Assignee: NEC Electronics Corporation
    Inventor: Manabu Onuma
  • Publication number: 20080070381
    Abstract: In a semiconductor wafer including a plurality of element forming regions formed on a front surface of a semiconductor substrate, a scribe line groove is formed along a periphery of the each of the element forming regions, and stoppers are located at an intersection of the scribe line groove, so as to block the scribe line groove.
    Type: Application
    Filed: October 31, 2007
    Publication date: March 20, 2008
    Applicant: NEC Electronics Corporation
    Inventor: Manabu Onuma
  • Publication number: 20050224920
    Abstract: In a semiconductor wafer including a plurality of element forming regions formed on a front surface of a semiconductor substrate, a scribe line groove is formed along a periphery of the each of the element forming regions, and stoppers are located at an intersection of the scribe line groove, so as to block the scribe line groove.
    Type: Application
    Filed: January 21, 2005
    Publication date: October 13, 2005
    Applicant: NEC Electronics Corporation
    Inventor: Manabu Onuma