Abstract: An electricity storage device includes a stack of bipolar electrodes each including a steel sheet, and a plating layer provided on a surface of the steel sheet. The plating layer includes a base nickel-plating layer provided on the surface of the steel sheet, and a surface nickel-plating layer provided on the base nickel-plating layer, and having a surface roughness greater than that of the base nickel-plating layer.

Abstract: An electricity storage device includes a stack of bipolar electrodes each including a steel sheet, and a plating layer provided on a surface of the steel sheet. The plating layer includes a base nickel-plating layer provided on the surface of the steel sheet, and a surface nickel-plating layer provided on the base nickel-plating layer, and having a surface roughness greater than that of the base nickel-plating layer.

Abstract: A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect.

Abstract: A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.

Abstract: A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.

Abstract: A process for manufacturing workpiece whose surface is to be plated by means of electroless plating includes an ozone-processing step, and a superficial-layer removing step. In the ozone-processing step, a workpiece body including resin and having a surface is processed by means of an ozone treatment by brining the workpiece body into contact with a solution including ozone. Thus, a modified layer is formed on the surface of the workpiece body. Then, in the superficial-layer removing step, a superficial layer is removed from the resultant modified layer by applying energy onto the modified layer.

Abstract: A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect.