Abstract: A liquid discharge head includes: a junction substrate including a first substrate and a second substrate joined with each other by an adhesive. A first surface of the first substrate to be joined with the second substrate is configured to have a plurality of first openings each configured to serve as a liquid passage, a first depressed portion capable of retaining the adhesive, and a second depressed portion configured to have a larger opening area than that of the first depressed portion and to be capable of retaining the adhesive; in a region between the adjacent two first openings of the plurality of first openings, the first depressed portion is arranged; and the second depressed portion is arranged in a region between the first opening and an outer edge of the first substrate.

Abstract: A flow path member includes a first substrate having a first surface that has a flow path, and includes a second substrate having a second surface opposing the first surface. In the flow path member in which the first and second substrates are joined together with adhesive provided between the first and second surfaces, a groove is formed in at least one of the first and second surfaces. When the first substrate is viewed from a direction orthogonal to the first surface, the flow path is disposed on a groove inner side. The groove has a first portion having a first depth and a second portion having a second depth shallower than the first depth. The second portion is that portion of the groove existing inside a region surrounded by an outer edge of the first surface and extension lines of two sides that form a flow path corner.

Abstract: Provided is a joined substrate in which a first substrate, a second substrate, and a third substrate are joined in this order with an adhesive agent therebetween, the joined substrate comprising: one or more grooves formed in a groove region of a surface of the first substrate not facing the second substrate; and a bulging portion formed in a back region of a surface of the second substrate not facing the first substrate, the bulging portion bulging in a thickness direction, the back region corresponding to the groove region in a plane direction.

Abstract: An object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. To that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove.

Abstract: An object is to provide a channel-forming substrate capable of suppressing protrusion of a bonding adhesive while maintaining rigidity. The channel-forming substrate includes a first substrate in which a hollow portion to be a liquid channel is formed and a second substrate bonded to the first substrate with a bonding adhesive, in the first substrate, a plurality of first grooves are intermittently formed in a bonding surface bonded to the second substrate, in the second substrate, a plurality of second grooves are intermittently formed in a bonding surface bonded to the first substrate, and in a case where the channel-forming substrate is viewed from above, the first grooves and the second grooves are arranged alternately so as to surround the hollow portion.

Abstract: A sound output device includes an acquisition unit, an ear speaker, and a sound controller. The acquisition unit acquires data of an information sound providing an operator with information. The ear speaker outputs the information sound such that sound pressure of the information sound at a position of an ear of the operator is higher than sound pressure at positions other than the position of the ear. The sound controller controls the ear speaker to emphasize the information sound more when the information sound indicates a high degree of necessity for the operator to take action against the information sound than when the information sound indicates a low degree of the necessity.

Abstract: A liquid ejection head includes a first substrate having a first surface and a second surface opposite the first surface, the first surface having a structure, a second substrate having a second surface facing the first surface of the first substrate, and a third substrate having a first surface facing the second surface of the first substrate. The first, second, and third substrates are joined together by an adhesive. The second surface of the first substrate has an opening located in a region on a rear side of the structure and having corners each having a curvature radius R2. The second surface of the second substrate has an opening in a region facing the structure and having corners each having a curvature radius R1. The curvature radii R1 and R2 satisfy R1<R2.

Abstract: A flow path member includes a first substrate, a second substrate, bonding adhesive, and recessed portions. The first substrate has a first surface formed with an opening of a flow path. The second substrate has a second surface facing the first surface. The bonding adhesive bonds the first and second surfaces together. The recessed portions are formed in at least one of the first surface of the first substrate and the second surface of the second substrate. Each recessed portion is a hole configured to take up excess bonding adhesive and, as a non-through hole, does not extend through the entire thickness of a substrate. Each of the recessed portions extends into the first substrate or the second substrate as a rectangular column or an elliptical column and, when a shape of each recessed portion is viewed from the direction orthogonal to the first surface, the shape is approximately isotropic.

Abstract: A flow path member includes a first substrate having a first surface that has a flow path, and includes a second substrate having a second surface opposing the first surface. In the flow path member in which the first and second substrates are joined together with adhesive provided between the first and second surfaces, a groove is formed in at least one of the first and second surfaces. When the first substrate is viewed from a direction orthogonal to the first surface, the flow path is disposed on a groove inner side. The groove has a first portion having a first depth and a second portion having a second depth shallower than the first depth. The second portion is that portion of the groove existing inside a region surrounded by an outer edge of the first surface and extension lines of two sides that form a flow path corner.

Abstract: The present invention provides a liquid replenishment container that replenishes a liquid tank including a liquid supply portion protruding in a first direction with a liquid. The container includes: a container main body capable of storing a liquid; a liquid replenishment nozzle including a first side wall and mountable on the liquid supply portion, the first side wall defining an internal space communicating with the container main body; and a valve body provided in the internal space and causing the liquid supply portion to communicate with the internal space when the liquid replenishment nozzle is mounted. The internal space has a first liquid replenishment flow path formed between the valve body and the first side wall and being constant in cross-section in the first direction, and a second liquid replenishment flow path formed inside the first liquid replenishment flow path and being continuous in the first direction.

Abstract: A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.

Abstract: A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Abstract: The present invention provides a liquid replenishment container that replenishes a liquid tank including a liquid supply portion protruding in a first direction with a liquid. The container includes: a container main body capable of storing a liquid; a liquid replenishment nozzle including a first side wall and mountable on the liquid supply portion, the first side wall defining an internal space communicating with the container main body; and a valve body provided in the internal space and causing the liquid supply portion to communicate with the internal space when the liquid replenishment nozzle is mounted. The internal space has a first liquid replenishment flow path formed between the valve body and the first side wall and being constant in cross-section in the first direction, and a second liquid replenishment flow path formed inside the first liquid replenishment flow path and being continuous in the first direction.

Abstract: Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.

Abstract: A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.

Abstract: A resin film laminated on a support film is attached to the surface of a substrate having a pattern of unevenness. Firstly, the substrate is placed on a stage with the surface side up. Secondly, the resin film is placed so as to face the surface of the substrate and the surface is scanned with a roller while the resin film is pressed against the surface from the side of the support film to bring them into contact with each other. Surface temperatures of the stage and the roller are set to form a temperature gradient such that the temperature of the surface of the resin film to be attached to the surface of the substrate becomes not lower than the softening temperature of the resin film and the temperature of the surface of the support film side becomes lower than the softening temperature of the resin film.

Abstract: A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Abstract: A method of manufacturing a structure including a substrate and a photosensitive resin layer provided on the substrate includes irradiating a region of the photosensitive resin layer with light in a state where a layer is provided on a surface of the substrate, the region being located above a space surrounded by the substrate and the photosensitive resin layer, and the surface facing the space, and removing a portion of the photosensitive resin layer located above the space to form a hole, wherein the provided layer has a reflectance of 40% or less with respect to the light.

Abstract: A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X?30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Abstract: Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.