Patents by Inventor Manabu Shirakihara

Manabu Shirakihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electron microscopic inspection apparatus
    Patent number: 7091496
    Abstract: Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in contact with wafers, such as hands of a wafer transporter, are duplicated or more and one of the elements that contact wafers is used appropriately for the wafers under inspection which may be either the wafers on which copper wiring was performed or the wafers on which non-copper wiring was performed.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: August 15, 2006
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Sho Takami, Tadashi Otaka, Manabu Shirakihara
  • Electron microscopic inspection apparatus
    Publication number: 20040036489
    Abstract: Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in contact with wafers, such as hands of a wafer transporter, are duplicated or more and one of the elements that contact wafers is used appropriately for the wafers under inspection which may be either the wafers on which copper wiring was performed or the wafers on which non-copper wiring was performed.
    Type: Application
    Filed: June 17, 2003
    Publication date: February 26, 2004
    Inventors: Sho Takami, Tadashi Otaka, Manabu Shirakihara