Patents by Inventor Manabu SUDOU

Manabu SUDOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240414848
    Abstract: A flexible printed circuit board includes an electrically conductive line, and a land connected to the electrically conductive line and to be connected to a terminal, the land including soldering portions that have metal surfaces and to which the terminal is to be soldered. The terminal includes an overlapping section that overlaps the flexible printed circuit board and a protruding section that protrudes outward from the flexible printed circuit board and is soldered to a connecting member that connects electrode portions of power storage elements.
    Type: Application
    Filed: August 22, 2024
    Publication date: December 12, 2024
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Tsutomu KITAJIMA, Yoshiro ADACHI, Yuuki OOHASHI, Manabu SUDOU
  • Patent number: 12114429
    Abstract: A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: October 8, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo Takahashi, Shinichi Takase, Hiroki Shimoda, Tsutomu Kitajima, Yoshiro Adachi, Yuuki Oohashi, Manabu Sudou
  • Patent number: 12101888
    Abstract: A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: September 24, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo Takahashi, Shinichi Takase, Hiroki Shimoda, Tsutomu Kitajima, Yoshiro Adachi, Yuuki Oohashi, Manabu Sudou
  • Publication number: 20220394855
    Abstract: A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.
    Type: Application
    Filed: September 7, 2020
    Publication date: December 8, 2022
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Tsutomu KITAJIMA, Yoshiro ADACHI, Yuuki OOHASHI, Manabu SUDOU
  • Publication number: 20220394856
    Abstract: A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.
    Type: Application
    Filed: September 7, 2020
    Publication date: December 8, 2022
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Tsutomu KITAJIMA, Yoshiro ADACHI, Yuuki OOHASHI, Manabu SUDOU
  • Patent number: 11245237
    Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: February 8, 2022
    Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES. LTD.
    Inventors: Yoshiro Adachi, Yoshifumi Uchita, Manabu Sudou, Yoshio Oka
  • Publication number: 20210044067
    Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 11, 2021
    Inventors: Yoshiro ADACHI, Yoshifumi UCHITA, Manabu SUDOU, Yoshio OKA