Abstract: A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

Abstract: A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

Abstract: A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

Abstract: A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

Abstract: A surface illuminant device includes a surface illuminant having a light distribution characteristic with no directivity relative to specific directions, and a prism sheet having a plurality of prisms each having a predetermined apical angle. The prism sheet is placed on the light emission side of the surface illuminant. One side of the prism sheet on which a plurality of prisms are placed is opposite to the light emission side of the surface illuminant. Accordingly, light can be emitted in a plurality of specific directions in concentrative manner to enhance luminance in that plurality of directions. Further, the surface illuminant device includes an optical sheet which condenses the incident light. In the luminance distribution (light distribution characteristic) thus obtained, the luminance gently decreases in the vicinity of the directions in which light is emitted in concentrative manner.

Abstract: A gas heating cooker to be used as a grill or an oven, wherein the blow-off air current of the blowing apparatus blows along the flames of the lower burner to get the hot current to reach far, so that the heating chamber becomes superwide enough to allow a lot of cooking, with the result that the heating operation may be effected with uniform heat distribution in the full face of the heating chamber, and a superior cooking property from even cooking is provided.

Abstract: A high performance automatic temperature control system enables fries and Japanese tempura to be prepared in optimum condition.The temperature of the outer bottom surface of a container being heated is measured by a temperature sensor a given time later. A temperature rise gradient of the temperature sensor established at a given time in the initial stage of heating is used as a temperature correction value peculiar to the container, while a temperature rise gradient of the temperature sensor established after a certain temperature has been reached is used as a temperature correction value for the amount of food being cooked. The former and latter temperature correction values are converted into preset temperature values and serve as operating temperatures for the temperature sensor.When the temperature sensor reaches the operating temperature, the heating rate is controlled to hold the operating temperature.