Abstract: A liquid dispenser includes a substrate and a plurality of liquid-dispensing portions, arranged on the substrate, including at least one liquid chamber for storing liquid, one nozzle, and one heating element, wherein the heating elements are energized to heat liquid stored in the corresponding liquid chambers to eject a droplet of the liquid from the corresponding nozzles; the heating elements and the liquid chambers have a protective layer and an insulating layer therebetween; each heating element, the insulating layer, the protective layer, and each liquid chamber are arranged in that order; the insulating layer isolates the protective layer from the heating elements; and the protective layer comprises an inorganic material, protects the heating elements, has a strip shape so as to cover some of the plurality of heating elements adjacent to each other, and has slits each disposed between the heating elements. A printer includes such a liquid dispenser.

Abstract: A liquid dispenser includes a substrate and a plurality of liquid-dispensing portions, arranged on the substrate, including at least one liquid chamber for storing liquid, one nozzle, and one heating element, wherein the heating elements are energized to heat liquid stored in the corresponding liquid chambers to eject a droplet of the liquid from the corresponding nozzles; the heating elements and the liquid chambers have a protective layer and an insulating layer therebetween; each heating element, the insulating layer, the protective layer, and each liquid chamber are arranged in that order; the insulating layer isolates the protective layer from the heating elements; and the protective layer comprises an inorganic material, protects the heating elements, has a strip shape so as to cover some of the plurality of heating elements adjacent to each other, and has slits each disposed between the heating elements. A printer includes such a liquid dispenser.

Abstract: The present invention fixes a nozzle sheet on a substrate with a predetermined material (5,6), which has an excellent chemical resistance and sufficient adhesiveness, or more specifically, fixes the nozzle sheet on the substrate with cyclized rubber or with patternable, adhesive elastic material. Moreover, the present invention forms walls for liquid chambers and liquid channels with polyimide.

Abstract: In a method and an apparatus for ejecting liquid, the processing accuracy of an ejection unit for ejecting ink can be easily increased and the variations in the volume of ink drops, the ejection angle thereof, etc., can be reduced even when dust is mixed in ink. In addition, a reduction in an ink-supply speed at which ink is supplied to an ink ejection unit can be prevented. An ink ejection apparatus includes a plurality of heating units (13) provided on a base member (11), ink cells for pressurizing ink with energy generated by the heating units (13), and nozzles (17) having ejection holes for ejecting the ink which is pressurized in the ink cells. Each of the nozzles (17) is disposed above each of the heating units (13).

Abstract: A liquid dispenser includes a substrate and a plurality of liquid-dispensing portions, arranged on the substrate, including at least one liquid chamber for storing liquid, one nozzle, and one heating element, wherein the heating elements are energized to heat liquid stored in the corresponding liquid chambers to eject a droplet of the liquid from the corresponding nozzles; the heating elements and the liquid chambers have a protective layer and an insulating layer therebetween; each heating element, the insulating layer, the protective layer, and each liquid chamber are arranged in that order; the insulating layer isolates the protective layer from the heating elements; and the protective layer comprises an inorganic material, protects the heating elements, has a strip shape so as to cover some of the plurality of heating elements adjacent to each other, and has slits each disposed between the heating elements. A printer includes such a liquid dispenser.

Abstract: A printer, a print head, and a print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the projecting objects are removed so that ink cells and nozzles are formed. The thickness of the setting resin is determined such that tip portions of the projecting objects project from the setting resin and ink cells can be formed.

Abstract: A printer, a print head, and a print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the projecting objects are removed so that ink cells and nozzles are formed. The thickness of the setting resin is determined such that tip portions of the projecting objects project from the setting resin and ink cells can be formed.

Abstract: The invention relates to a method for forming connection holes reliably by making contact resistance low and uniform in semiconductor devices. Insulating layer 3, that includes SOG layer 7, is plasma etched using an etching gas with a small quantity of a gas with a low C/F ratio, such as CHF3, mixed with a gas with a high C/F ratio, such as C4F8/Ar/O2 at a ratio of 1:3.

Abstract: A process for producing a semiconductor device and an apparatus and a process for obtaining an optimum film thickness, the process for producing a semiconductor device comprising forming a film of a light reflecting material on a semiconductor substrate; coating a positive resist on the film of a light reflecting material; forming a resist pattern from the positive resist; and etching the film of a light reflecting material using the resist pattern as a mask, wherein simulation of light intensity is conducted by using optical constants of the semiconductor substrate, the film of a light reflecting material and the resist obtained by measuring the optical constants thereof, or when optical constants thereof are known, by using the known optical constants, with varying a film thickness of the film of a light reflecting material to plural values, so as to obtain a film thickness of the film of a light reflecting material that makes a light absorption energy at an interface between the film of a light reflecting

Abstract: The invention provides a plotting pattern data production method suitable for use for production of a mask for exposure or a semiconductor integrated circuit wherein a minimum plotting grid of a magnitude used in an existing apparatus can be used and a semiconductor integrated circuit pattern having a desired size can be formed accurately.

Abstract: The present invention provides a diode limiter device in which a first penetration hole is formed on a wall surface of an H surface; the PIN diode is supported by the PIN diode mounting side of the post with the PIN diode being electrically connected to the waveguide at the first penetration hole; a second penetration hole is formed on the other wall surface opposite to the wall surface; a second conductive boss which grasps the PIN diode with the post is electrically insulated and supported with respect to the second penetration hole; a wiring substrate with the detection diode and the resistor mounted thereon is installed; and the wiring substrate is supported in the second penetration hole by a third boss, thereby improving productivity and reducing cost.

Abstract: A method for washing a photomask substrate or a semiconductor wafer. The mixing heat generated on mixing H.sub.2 SO.sub.4 and H.sub.2 O.sub.2 is effectively utilized for promoting the reaction. H.sub.2 SO.sub.4 and H.sub.2 O.sub.2 are discharged from separate nozzles and mixed at a mixing point directly below and proximate to the nozzles to give a H.sub.2 SO.sub.4 --H.sub.2 O.sub.2 liquid mixture. The liquid mixture is caused to descend onto near the center of the photomask kept in rotation so that the liquid mixture is spread over the substrate surface under a centrifugal force. The H.sub.2 SO.sub.4 --H.sub.2 O.sub.2 flow ratios, the height of the mixing point and the number of revolutions of the substrate are controlled for providing the uniform temperature distribution of the liquid mixture on the substrate surface and for achieving uniform washing.