Patents by Inventor Manabu YOKOZUKA

Manabu YOKOZUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200299549
    Abstract: An adhesive sheet capable of bonding adhesive layers together at normal temperatures, with little stickiness of the adhesive layers due to a plasticizer seeping out from a substrate providing a protective material using the adhesive sheet and a wire harness. An adhesive sheet including: a substrate containing 20-100 parts by mass of a polyester-based plasticizer to 100 parts by mass of a vinyl halide-based resin; a primer layer; adhesive layers included amount of a tackifier is 0-250 parts by mass and the inorganic microparticles is 0-250 parts by mass to 100 parts by mass of an elastomer, and a total value of the included amounts of the tackifier and the inorganic microparticles is 0-350 parts by mass; wherein the adhesive layers probe tack of 7 N/cm2 or less with ASTM D 2979, and the adhesive force between the adhesive layers width of 15 mm is 1.5 N or more.
    Type: Application
    Filed: August 23, 2018
    Publication date: September 24, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yuto HONDA, Manabu YOKOZUKA, Mizuki HASUMI
  • Publication number: 20200071573
    Abstract: An adhesive sheet including a substrate and adhesive layers that are arranged on one surface of the substrate with a primer layer being interposed therebetween, wherein the adhesive layers include a natural rubber and a tackifier, the adhesive sheet has a volume resistivity of 1×1010? cm or more and a tensile modulus at 100% elongation of 50 MPa or less as determined in accordance with JIS K 6251, the adhesive layers have a probe tack of 10N/cm2 or less as determined in accordance with ASTM D 2979, the adhesive force between the adhesive layers having a width of 15 mm is 1.5 N or more, and the adhesive force between the substrate and the adhesive layers having a width of 15 mm is 1.5 N or less.
    Type: Application
    Filed: March 15, 2018
    Publication date: March 5, 2020
    Applicants: DENKA COMPANY LIMITED, SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Manabu YOKOZUKA, Mizuki HASUMI, Manabu KUME, Takashi IDE