Patents by Inventor Manami INAI

Manami INAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor assembling structure for rotary mounting-type windshield mounted inner mirror for vehicle
    Patent number: 11254264
    Abstract: A sensor assembling structure includes a sensor assembling void formed in a mounting base, a sensor assembling leaf spring, and mounting base-side leaf spring mounting portions formed at the mounting base. The mounting base is mounted to a windshield. The sensor assembling void receives a sensor. The sensor assembling leaf spring includes mounting base mounted portions. In a state in which the sensor is received in the sensor assembling void, the sensor assembling leaf spring is mounted to the mounting base-side leaf spring mounting portions via the mounting base mounted portions. The sensor assembling leaf spring maintains a state in which the sensor is received in the sensor assembling void.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: February 22, 2022
    Assignees: MURAKAMI CORPORATION, HONDA MOTOR CO., LTD.
    Inventors: Naomi Sugimura, Tatsuya Ohmaru, Manami Inai
  • SENSOR ASSEMBLING STRUCTURE FOR ROTARY MOUNTING-TYPE WINDSHIELD MOUNTED INNER MIRROR FOR VEHICLE
    Publication number: 20200361380
    Abstract: A sensor assembling structure includes a sensor assembling void formed in a mounting base, a sensor assembling leaf spring, and mounting base-side leaf spring mounting portions formed at the mounting base. The mounting base is mounted to a windshield. The sensor assembling void receives a sensor. The sensor assembling leaf spring includes mounting base mounted portions. In a state in which the sensor is received in the sensor assembling void, the sensor assembling leaf spring is mounted to the mounting base-side leaf spring mounting portions via the mounting base mounted portions. The sensor assembling leaf spring maintains a state in which the sensor is received in the sensor assembling void.
    Type: Application
    Filed: January 29, 2019
    Publication date: November 19, 2020
    Applicants: MURAKAMI CORPORATION, HONDA MOTOR CO., LTD.
    Inventors: Naomi SUGIMURA, Tatsuya OHMARU, Manami INAI