Patents by Inventor Manato NAMEKAWA

Manato NAMEKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230193133
    Abstract: A polysilicon fractured product includes fractured pieces including a ridge portion generated by fracturing a polysilicon rod. An average radius of curvature (r) of the fractured pieces is 50 ?m or more at a tip end of a ridge portion having an angle of 70° or less. The polysilicon fractured product is obtained by a method including fracturing a polysilicon rod to obtain fractured pieces, and etching at an etching speed of 2.5 ?m/min or less to achieve an etching depth of 5 ?m or more by immersing the fractured pieces obtained in the fracturing in an etching solution.
    Type: Application
    Filed: May 20, 2021
    Publication date: June 22, 2023
    Inventor: Manato Namekawa
  • Patent number: 11428685
    Abstract: Provided is an analysis method capable of qualitatively determining resins adhering to crushed polysilicon with high sensitivity and further capable of quantitatively determining the resins with high precision. The analysis method comprises removing organic volatile components from crushed polysilicon by heating, then raising a temperature of the crushed polysilicon in a stream of an inert gas, collecting resin decomposition products produced at the heating temperature, and analyzing decomposition products unique to the resins, to thereby identify the types of the resins adhering to the crushed polysilicon. Moreover, it is also possible to prepare a standard curve regarding each of the decomposition products unique to the resins and to determine an adhesion quantity of each of the adhering resins based on the standard curve.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: August 30, 2022
    Assignee: Tokuyama Corporation
    Inventors: Manato Namekawa, Mikie Takemoto
  • Publication number: 20190391126
    Abstract: Provided is an analysis method capable of qualitatively determining resins adhering to crushed polysilicon with high sensitivity and further capable of quantitatively determining the resins with high precision. The analysis method comprises removing organic volatile components from crushed polysilicon by heating, then raising a temperature of the crushed polysilicon in a stream of an inert gas, collecting resin decomposition products produced at the heating temperature, and analyzing decomposition products unique to the resins, to thereby identify the types of the resins adhering to the crushed polysilicon. Moreover, it is also possible to prepare a standard curve regarding each of the decomposition products unique to the resins and to determine an adhesion quantity of each of the adhering resins based on the standard curve.
    Type: Application
    Filed: December 14, 2017
    Publication date: December 26, 2019
    Applicant: Tokuyama Corporation
    Inventors: Manato NAMEKAWA, Mikie TAKEMOTO