Patents by Inventor Manato NISHIDE

Manato NISHIDE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting head
    Patent number: 11302666
    Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 12, 2022
    Assignee: SHINKAWA LTD.
    Inventors: Manato Nishide, Kohei Seyama, Hijiri Hayashi
  • MOUNTING HEAD
    Publication number: 20200051947
    Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.
    Type: Application
    Filed: November 17, 2017
    Publication date: February 13, 2020
    Applicant: SHINKAWA LTD.
    Inventors: Manato NISHIDE, Kohei SEYAMA, Hijiri HAYASHI