Patents by Inventor Manda Shaeffer

Manda Shaeffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12725902
    Abstract: Provided are apparatus and methods for providing thermal management for RF transparent systems. In particular, a layered composite is provided that includes a first thermally conductive and RF transparent layer along with a second RF transparent system structural layer. The system also includes an attached heat sink(s) to reduce the effective operating temperature of the underlying materials in the RF transparent system such as the thermally conductive layer. Accordingly, the use of this thermal management system allows for the use of more conventional, lower-temperature RF transparent system materials in subsequent layers. Additionally, reducing the operating temperature with the thermally conductive layer and heat sink improves the RF transparency in the RF transparent system.
    Type: Grant
    Filed: March 14, 2024
    Date of Patent: September 1, 2026
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Cole R. Davis, Manda Shaeffer
  • Publication number: 20240313387
    Abstract: Provided are apparatus and methods for providing thermal management for RF transparent systems. In particular, a layered composite is provided that includes a first thermally conductive and RF transparent layer along with a second RF transparent system structural layer. The system also includes an attached heat sink(s) to reduce the effective operating temperature of the underlying materials in the RF transparent system such as the thermally conductive layer. Accordingly, the use of this thermal management system allows for the use of more conventional, lower-temperature RF transparent system materials in subsequent layers. Additionally, reducing the operating temperature with the thermally conductive layer and heat sink improves the RF transparency in the RF transparent system.
    Type: Application
    Filed: March 14, 2024
    Publication date: September 19, 2024
    Applicant: The United States of America, as represented by the Secretary of the Navy
    Inventors: Cole R. Davis, Manda Shaeffer