Patents by Inventor Mandan Dubey

Mandan Dubey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-assembled electrical contacts
    Patent number: 8318595
    Abstract: Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprising a solder alloy positioned on the metallization layer, wherein the solder alloy is liquefied to allow the bump structure to self-assemble and align with the part electrical binding site using capillary forces, and wherein the solder alloy only liquefies at a temperature above that at which the self-assembly and alignment is performed; and a fluid on the template electrical conductor layer, wherein the fluid comprises a melting point lower than that of the solder alloy, wherein the fluid binds with the part binding site.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: November 27, 2012
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Christopher J. Morris, Mandan Dubey
  • Self-Assembled Electrical Contacts
    Publication number: 20100139954
    Abstract: Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprising a solder alloy positioned on the metallization layer, wherein the solder alloy is liquefied to allow the bump structure to self-assemble and align with the part electrical binding site using capillary forces, and wherein the solder alloy only liquefies at a temperature above that at which the self-assembly and alignment is performed; and a fluid on the template electrical conductor layer, wherein the fluid comprises a melting point lower than that of the solder alloy, wherein the fluid binds with the part binding site.
    Type: Application
    Filed: November 24, 2009
    Publication date: June 10, 2010
    Inventors: Christopher J. Morris, Mandan Dubey