Patents by Inventor Mandar Painaik

Mandar Painaik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System-in-package including opposing circuit boards
    Patent number: 10966321
    Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 30, 2021
    Assignee: Apple Inc.
    Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
  • SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
    Publication number: 20200375033
    Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
    Type: Application
    Filed: June 5, 2020
    Publication date: November 26, 2020
    Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
  • System-in-package including opposing circuit boards
    Patent number: 10709018
    Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: July 7, 2020
    Assignee: Apple Inc.
    Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
  • SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
    Publication number: 20190306979
    Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
    Type: Application
    Filed: May 30, 2019
    Publication date: October 3, 2019
    Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
  • System-in-package including opposing circuit boards
    Patent number: 10356903
    Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: July 16, 2019
    Assignee: Apple Inc.
    Inventors: Yanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee