Patents by Inventor Mandy Hin Lam

Mandy Hin Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10285291
    Abstract: In one embodiment, an apparatus includes a line card ejector configured to engage with a chassis to retain the line card within a slot in the chassis in a closed position, a locking member movable between a locked position in which the ejector is locked in its closed position and an unlocked position in which the ejector may be moved to an open position to remove the line card from the chassis, and an actuation device for moving the locking member from its locked position to its unlocked position. The locking member comprises an accessible release lever for moving the locking member from its locked position to its unlocked position without use of the actuation device for emergency release and removal of the line card. A method for emergency release of the line card is also disclosed herein.
    Type: Grant
    Filed: February 17, 2018
    Date of Patent: May 7, 2019
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Mandy Hin Lam, Vic Hong Chia, Keith Frank Tharp
  • Patent number: 9585283
    Abstract: A high insertion force ejector is provided. The high insertion force ejector includes an ejector mounting base, a pressure bar-ejector tooth, a first cam, and a second cam. The pressure bar-ejector tooth is connected to the ejector mounting base. A lever handle is operatively connected to the pressure bar-ejector and the ejector mounting base. The first cam and the second cam are operatively connected to the pressure bar-ejector tooth and the lever handle.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: February 28, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Vic Hong Chia, Mandy Hin Lam, Frank Jun, Hong Tran Huynh
  • Patent number: 9379039
    Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: June 28, 2016
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Mandy Hin Lam, Hong Tran Huynh, M. Baris Dogruoz
  • Publication number: 20160128230
    Abstract: A faceplate of a line card is provided, and in one example embodiment, includes a top panel including a portion angled downward towards a front side of the faceplate, the angled portion having a plurality of holes, and a front panel disposed on the front side of the faceplate, attached to the angled portion of the top panel on its top side and having a beveled edge at its bottom side, the angled portion of the top panel and the beveled edge of the front panel facilitating an intake area for air flow between the line card and other parallel line cards assembled on a chassis. In specific embodiments, the plurality of holes are arranged in a honeycomb pattern with each hole comprising a Reuleaux hexagon having rounded corners.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 5, 2016
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Mandy Hin Lam, Hong Tran Huynh, Vic Hong Chia, M. Baris Dogruoz
  • Publication number: 20150124425
    Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 7, 2015
    Applicant: Cisco Technology, Inc.
    Inventors: Jing An, Luli Gong, Hua Yang, Hailong Zhang, Dewen Xu, Susan Huang, Mandy Hin Lam
  • Publication number: 20150062820
    Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.
    Type: Application
    Filed: September 4, 2013
    Publication date: March 5, 2015
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Mandy Hin Lam, Hong Tran Huynh, M. Baris Dogruoz
  • Patent number: 8964385
    Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: February 24, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Mandy Hin Lam, Phillip S. Ting, Susheela Nanjunda Rao Narasimhan
  • Patent number: 8795001
    Abstract: A pass-through connector is provided in one example and includes a first groove to be coupled to a power supply bus bar; a second groove to be coupled to a power return bus bar; and a plurality of electrical pins disposed on a surface of the connector and configured for interfacing with a circuit board, which is coupled to a line card power connector that is configured to receive a line card.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: August 5, 2014
    Assignee: Cisco Technology, Inc.
    Inventors: Mandy Hin Lam, Pirooz Tooyserkani, Jonathan L. Smith
  • Publication number: 20140187068
    Abstract: A high insertion force ejector may be provided. The high insertion force ejector may comprise an ejector mounting base, a pressure bar-ejector tooth, a first cam, and a second cam. The pressure bar-ejector tooth may be connected to the ejector mounting base. A lever handle may be operatively connected to the pressure bar-ejector and the ejector mounting base. The first cam and the second cam may be operatively connected to the pressure bar-ejector tooth and the lever handle.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 3, 2014
    Applicant: Cisco Technology, Inc.
    Inventors: Vic Hong Chia, Mandy Hin Lam, Frank Jun, Hong Tran Huynh
  • Publication number: 20140098492
    Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.
    Type: Application
    Filed: October 5, 2012
    Publication date: April 10, 2014
    Inventors: Mandy Hin Lam, Phillip S. Ting, Susheela Nanjunda Rao Narasimhan
  • Patent number: 8260997
    Abstract: In one embodiment, a method comprises initiating shutdown of network traffic of a line card while the line card is coupled to a connector chassis and exchanging network traffic, the initiating shutdown in response to actuation of a magnetic switch associated with the line card, the magnetic switch being actuated in response to movement of actuating structure that unlocks the line card for removal from the connector chassis; and completing the shutdown of network traffic in the line card prior to permitting complete removal of the line card from the connector chassis.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: September 4, 2012
    Assignee: Cisco Technology, Inc.
    Inventors: Frans Kusnadi, Jimmy Che-Kin Leung, Mandy Hin Lam