Patents by Inventor Manes Eliacin
Manes Eliacin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7508352Abstract: An embedded assembly (200) and method for fabricating the same is provided. The embedded assembly includes an organic substrate (102) and at least one movable element (104). The embedded assembly also includes at least one antenna element (106). The method includes providing (502) the organic substrate, and embedding (504) the at least one moveable element on the organic substrate. The method also includes embedding (506) the at least one antenna element on the organic substrate.Type: GrantFiled: January 18, 2006Date of Patent: March 24, 2009Assignee: Motorola, Inc.Inventors: Robert Lempkowski, Manes Eliacin, Keryn Lian
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Patent number: 7463113Abstract: A first and second capacitor plate are provided (101 and 102). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed (103) in one of these openings as is at least a second electrically conductive path interface (104).Type: GrantFiled: February 28, 2006Date of Patent: December 9, 2008Assignee: Motorla, Inc.Inventors: Aroon Tungare, Manes Eliacin, Lih-Tyng Hwang, Robert Lempkowski, Junhua Liu, Jovica Savic
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Publication number: 20080013251Abstract: A first and second capacitor plate are provided (101 and 102). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed (103) in one of these openings as is at least a second electrically conductive path interface (104).Type: ApplicationFiled: February 28, 2006Publication date: January 17, 2008Applicant: MOTOROLA, INC.Inventors: Aroon Tungare, Manes Eliacin, Lih-Tyng Hwang, Robert Lempkowski, Junhua Liu, Jovica Savic
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Publication number: 20070164905Abstract: An embedded assembly (200) and method for fabricating the same is provided. The embedded assembly includes an organic substrate (102) and at least one movable element (104). The embedded assembly also includes at least one antenna element (106). The method includes providing (502) the organic substrate, and embedding (504) the at least one moveable element on the organic substrate. The method also includes embedding (506) the at least one antenna element on the organic substrate.Type: ApplicationFiled: January 18, 2006Publication date: July 19, 2007Applicant: MOTOROLA, INC.Inventors: Robert Lempkowski, Manes Eliacin, Keryn Lian
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Patent number: 7217369Abstract: A meso-electromechanical system (900, 1100) includes a substrate (215), a standoff (405, 1160) disposed on a surface of the substrate, a first electrostatic pattern (205, 1105, 1110, 1115, 1120) disposed on the surface of the substrate, and a glass beam (810). The glass beam (810) has a fixed region (820) attached to the standoff and has a second electrostatic pattern (815, 1205, 1210, 1215, 1220) on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation (925) from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting (140).Type: GrantFiled: May 1, 2006Date of Patent: May 15, 2007Assignee: Motorola, Inc.Inventors: Jovica Savic, Manes Eliacin, Junhua Liu, Aroon V. Tungare
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Publication number: 20060226732Abstract: A meso-electromechanical system (900, 1100) includes a substrate (215), a standoff (405, 1160) disposed on a surface of the substrate, a first electrostatic pattern (205, 1105, 1110, 1115, 1120) disposed on the surface of the substrate, and a glass beam (810). The glass beam (810) has a fixed region (820) attached to the standoff and has a second electrostatic pattern (815, 1205, 1210, 1215, 1220) on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation (925) from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting (140).Type: ApplicationFiled: May 1, 2006Publication date: October 12, 2006Inventors: Jovica Savic, Manes Eliacin, Junhua Liu, Aroon Tungare
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Publication number: 20050134141Abstract: A meso-electromechanical system (900, 1100) includes a substrate (215), a standoff (405, 1160) disposed on a surface of the substrate, a first electrostatic pattern (205, 1105, 1110, 1115, 1120) disposed on the surface of the substrate, and a glass beam (810). The glass beam (810) has a fixed region (820) attached to the standoff and has a second electrostatic pattern (815, 1205, 1210, 1215, 1220) on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation (925) from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting (140).Type: ApplicationFiled: December 3, 2004Publication date: June 23, 2005Inventors: Jovica Savic, Manes Eliacin, Junhua Liu, Aroon Tungare
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Patent number: 6901217Abstract: Circuit boards (1100, 1400) and methods for fabricating circuit boards that include conduits (1004) are provided. The conduits formed by patterning a metal layer (1102) are lined by inert coating (1106) and caped by a photodefinable polymer layer (1110) that is affixed to the inert coating by with the help of an initially uncured polymer layer (1106). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.Type: GrantFiled: February 28, 2003Date of Patent: May 31, 2005Assignee: Motorolr, Inc.Inventors: Claudia V. Gamboa, Manes Eliacin, Keryn K. Lian
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Patent number: 6891190Abstract: An organic semiconductor device (11) can be embedded within a printed wiring board (10). In various embodiments, the embedded device (11) can be accompanied by other organic semiconductor devices (31) and/or passive electrical components (26). When so embedded, conductive vias (41, 42, 43) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.Type: GrantFiled: May 23, 2002Date of Patent: May 10, 2005Assignee: Motorola, Inc.Inventors: Ke Keryn Lian, Robert T. Croswell, Aroon Tungare, Manes Eliacin
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Patent number: 6859119Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.Type: GrantFiled: December 26, 2002Date of Patent: February 22, 2005Assignee: Motorola, Inc.Inventors: Manes Eliacin, Tomasz Klosowiak, Robert Lempkowski, Ke Lian
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Publication number: 20040170410Abstract: Circuit boards (1100, 1400) and methods for fabricating circuit boards that include conduits (1004) are provided. The conduits formed by patterning a metal layer (1102) are lined by inert coating (1106) and caped by a photodefinable polymer layer (1110) that is affixed to the inert coating by with the help of an initially uncured polymer layer (1106). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.Type: ApplicationFiled: February 28, 2003Publication date: September 2, 2004Inventors: Claudia V. Gamboa, Manes Eliacin, Keryn K. Lian
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Patent number: 6781056Abstract: Circuit boards (1100, 1500, 1600, 1700) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces (602, 702,704) are included in the circuit boards proximate temperature sensitive apparatus (1004, 1304, 1602, 1712). Thermally conductive patches (802, 902, 904) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit (1004).Type: GrantFiled: February 28, 2003Date of Patent: August 24, 2004Assignee: Motorola, Inc.Inventors: Shawn O'Rourke, Daniel J. Sadler, Marc K. Chason, Manes Eliacin, Claudia V. Gamboa, Robert Terbrueggen, Ke K. Lian
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Patent number: 6777629Abstract: A meso-scale MEMS device having a movable member (51) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member (51) is removed through openings (101, 102) as formed through a cover (91) to form a cavity (121) that retains and limits the freedom of movement of the movable member (51). The movable member can support a reflective surface (224) to thereby provide a mechanism that will support a projection display and/or image scanner (such as a bar code scanner).Type: GrantFiled: May 8, 2002Date of Patent: August 17, 2004Assignee: Motorola, Inc.Inventors: Spencer A. Lane, Krishna Jonnalagadda, Manes Eliacin
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Publication number: 20040124957Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.Type: ApplicationFiled: December 26, 2002Publication date: July 1, 2004Inventors: Manes Eliacin, Tomasz Klosowiak, Robert Lempkowski, Ke Lian
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Patent number: 6714105Abstract: A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.Type: GrantFiled: April 26, 2002Date of Patent: March 30, 2004Assignee: Motorola, Inc.Inventors: Manes Eliacin, Keryn Lian, Junhua Liu, Robert B. Lempkowski
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Publication number: 20040053290Abstract: The invention is directed to devices that allow for simultaneous multiple biochip analysis. In particular, the devices are configured to hold multiple cartridges comprising biochips comprising arrays such as nucleic acid arrays, and allow for high throughput analysis of samples.Type: ApplicationFiled: April 11, 2003Publication date: March 18, 2004Inventors: Robert Henry Terbrueggen, Gary F. Blackburn, Marc Kenneth Chason, Xunhu Dai, Manes Eliacin, Piotr Grodzinski, Bruce Duncan Irvine, Jon Faiz Kayyem, Keryn Ke Lian, Robin Hui Liu, Shawn Michael O'Rourke, Edward Lewis Sheldon, Frederic Zenhausern
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Publication number: 20030218165Abstract: An organic semiconductor device (11) can be embedded within a printed wiring board (10). In various embodiments, the embedded device (11) can be accompanied by other organic semiconductor devices (31) and/or passive electrical components (26). When so embedded, conductive vias (41, 42, 43) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.Type: ApplicationFiled: May 23, 2002Publication date: November 27, 2003Applicant: Motorola, Inc.Inventors: Ke Keryn Lian, Robert T. Croswell, Aroon Tungare, Manes Eliacin
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Publication number: 20030210116Abstract: A meso-scale MEMS device having a movable member (51) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member (51) is removed through openings (101, 102) as formed through a cover (91) to form a cavity (121) that retains and limits the freedom of movement of the movable member (51). The movable member can support a reflective surface (224) to thereby provide a mechanism that will support a projection display and/or image scanner (such as a bar code scanner).Type: ApplicationFiled: May 8, 2002Publication date: November 13, 2003Applicant: Motorola, Inc.Inventors: Spencer A. Lane, Krishna Jonnalagadda, Manes Eliacin
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Publication number: 20030201852Abstract: A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.Type: ApplicationFiled: April 26, 2002Publication date: October 30, 2003Applicant: Motorola, Inc.Inventors: Manes Eliacin, Keryn Lian, Junhua Liu, Robert B. Lempkowski