Abstract: The invention relates to an apparaus for ultrasonic wire bondings whereby the contact loci can be connected by wire straps, by means of ultrasonic welding, e.g. for connecting terminals on component mounts or the like to bonding islands on semiconductor chips. The inventive apparatus has means for combined axial and radial guiding of the rotatable bonding head, with low overall mass of the vertically movable parts and low moment of inertia around the rotational axis. As a result of the inventive disposition of the microscope objective, the object distance to the component can be set directly via the controllable vertical drive of the bonding head.

Abstract: The invention relates to an apparatus for ultrasonic wire bonding, whereby bonding loci can be interconnected by wire straps, by means of ultrasonic welding; in particular an apparatus in which bonding wire is guided and handled. According to the invention the bar (3) bearing the bonding head (2) has a longitudinal passage (4) in the direction of the ultrasound generator (35), which passage accommodates a guide tube (5) the upper end of which extends vertically upward out of the flange (6), near the rotational axis, and the lower end of which tube exits the bar (3) on an incline, in the outward direction, in the region of the mounting of the bonding head. A deflecting element (24) for the wire (40) is disposed above the upper end of the guide tube (5) and is not coupled with the rotational movement. The fact that the supply reel is mounted at a fixed location enables the employment of all customarily used type of reels, associated mounting means, and auxiliary elements for withdrawing the wire.