Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

Abstract: A heatable housing and a device such as a cooking appliance including a heatable housing for producing steam includes at least one wall that delimits an interior space, which is enclosed by the housing at least in areas and which serves to hold a liquid to be vaporized. The wall has at least one hollow for accommodating at least one heating device.

Abstract: A heatable housing and a device such as a cooking appliance including a heatable housing for producing steam includes at least one wall that delimits an interior space, which is enclosed by the housing at least in areas and which serves to hold a liquid to be vaporized. The wall has at least one hollow for accommodating at least one heating device.

Abstract: A method of adjusting at least one parameter of gas-operated cooking equipment as a function of the site and/or of the height of the site of the cooking equipment includes determining the geodetic height at the site during an initialization step by determining at least one physical parameter or a difference of two physical parameters and adjusting the heat output of at least one combustion system of the cooking equipment. The determined physical parameter may be air pressure, density, the mean ambient temperature, the humidity in the air and/or the boiling point of water and the physical parameter or the difference of the two physical parameters may be determined by starting up at least one functional group of the cooking equipment. The adjustment of the heat output of the combustion system of the cooking equipment may be performed by adjusting the air/fuel mixture in the region of an ignition device of the combustion system.