Patents by Inventor Manfred Cygon

Manfred Cygon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040037950
    Abstract: Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.
    Type: Application
    Filed: August 27, 2003
    Publication date: February 26, 2004
    Applicant: Fraunhofer Gesellschaft zur Forderung der angewandten Forschung E.V.
    Inventors: Wolfgang Scheel, Detlef Krabe, Manfred Cygon, Mathias Dietz
  • Publication number: 20030010530
    Abstract: Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.
    Type: Application
    Filed: June 19, 2002
    Publication date: January 16, 2003
    Inventors: Wolfgang Scheel, Detlef Krabe, Manfred Cygon, Mathias Dietz