Abstract: A foil-like functional material (1) providing a predefined function and may be used for targeted physical, chemical, physicochemical, biological, technical and technological purposes, and in which is arranged a support medium (2), which comprises a total support volume, has a cross-sectional extent (7) of ?100 ?m, like a matrix, and is formed from linear support elements (3a) and node-like support elements (3b), which form the substance components of the support medium (2) and pass through the total support volume to form a strip-like extent with interconnected partial volumes (5), situated therein and spanned by support elements (3) close by. The support elements (3) are sheathed with a first functional substance (4) which provides a first function. The remaining volume of the total support volume is filled with one second functional substance (6) which differs from the first function.

Abstract: The invention relates to an adhesive bond of a substrate material (1), whose surface and surface-near solid area contain polymer compounds with low active surface energy, and another material (4) and a method for the production of a corresponding adhesive bond. The invention more particularly relates to an adhesive metallized fluoropolymer, such as polytetrafluorethylene (PTFE), as a base material for printed circuit boards having a very high structural density (fine and very fine printed circuit boards) used in the GHz range and to a method for adhesive metallization of a corresponding fluoropolymer. According to the invention, the adhesive bond is formed by a nanostructured transition area (6), containing nanocomposites, between the substrate material (1) and the other material (4), inside which the substrate material (4) which is nanostructured changes into the other material (4). The nanocomposites are composed of substrate material (1) and the other material (4).

Abstract: The invention relates to an adhesive bond of a substrate material (1), whose surface and surface-near solid area contain polymer compounds with low active surface energy, and another material (4) and a method for the production of a corresponding adhesive bond. The invention more particularly relates to an adhesive metallized fluoropolymer, such as polytetrafluorethylene (PTFE), as a base material for printed circuit boards having a very high structural density (fine and very fine printed circuit boards) used in the GHz range and to a method for adhesive metallization of a corresponding fluoropolymer. According to the invention, the adhesive bond is formed by a nanostructured transition area (6), containing nanocomposites, between the substrate material (1) and the other material (4), inside which the substrate material (4) which is nanostructured changes into the other material (4). The nanocomposites are composed of substrate material (1) and the other material (4).

Abstract: A method and a system for processing carrier materials by means of heavy ion irradiation and subsequent etching, wherein the irradiation with heavy ions is carried out in such a way that a beam (1) of a high-energy heavy ion radiation (1.1) impinges on the surface (2) of a carrier material under at least two different angles. The fluence, energy and impinging direction of the heavy ion rays (1.1) are selected in such a way that there will result a maximum number of intersecting or coinciding latent ion traces (3) and common intersections of the recesses (4) resulting from a chemical etching process following heavy ion irradiation are obtained.