Abstract: An apparatus 100 for releasing a die 150 with a vacuum platform 130 with two or more segments 140 is provided, which may be extended independently of the surface of the vacuum platform 130 to push against the adhesive film 110 at the respective attachment in the direction of the die gripper 170. By providing two or more segments 140 that are independently extendable, die detachment (or at least partial detachment) may be performed in parallel, and two or more dies 150 may be detached before the adhesive film 110 needs to be repositioned. Both measures may increase throughput. In addition, empty attachment positions may be omitted.